kicad-developers team mailing list archive

[jean-pierre charras <jean-pierre.charras@...>]

Dick,

I played with The specctra export and freeRoute.
First tests are Ok.

I found a problem with pads having the type PAD_CONN (could be also 
found with PAD_SMD).

a PAD_CONN pad is basically the same as a PAD_SMD pad, but it is not on 
solder paste layer (this is the default setup).
(And will be coated by a nickel-gold layer, unlike a PAD_SMD pad which 
receives a solder past coat).

This type is intended to be used to create connectors like a PC ISA Bus 
card-edge connector.

The problem is :
In the current specctra export, smd pads (a PAD_CONN pad is a smd pad, 
if we consider only copper layers and routing) are expected always on  
the component layer (for a footprint on this layer).
But is is not always the case.
these pads can be put on the component AND / OR the copper layer, even 
the footprint is on the component layer.
( This could be also true for a SMD_PAD, for some connectors, but using  
the PAD_CONN attribute is better).

2 demos are using pads both on copper and component layer, for the same 
footprint, and cannot be routed by freeRoute:
in kicad/demos/interf_u there is an example using PC ISA Bus card-edge 
connector
in kicad/demos/sonde xilinx there is an example using 2 connectors (a 
DB9 and a DB25 connector, each both on copper and component layer)
The 3d view shows the mechanical design.

--

Jean-Pierre CHARRAS

Maître de conférences
Directeur d'études 2ieme année.
Génie Electrique et Informatique Industrielle 2
Institut Universitaire de Technologie 1 de Grenoble
BP 67, 38402 St Martin d'Heres Cedex

Recherche :
GIPSA-LIS - INPG
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38031 Grenoble cedex