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Message #02112
Stable release
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To:
kicad-devel@xxxxxxxxxxxxxxx
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From:
"jean-pierre.charras@..." <jean-pierre.charras@...>
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Date:
Sat, 24 Jan 2009 16:45:22 +0100
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In-reply-to:
<497AE13F.9090709@...>
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User-agent:
Thunderbird 2.0.0.19 (Windows/20081209)
Rok Markovic a écrit :
>
> HI to all!
>
> Yes, Jean-Piere I agree with you - it is not the code problem, it is
> program problem. We have to tell users what each parameter means, but I
> have no idea how. I am familiar with code, but I still ned some thinking
> how to set parameters. Does anyone knows, how can we suggest to user how
> to set parameters (maybe some sort of image) ???
>
> I would like to see per_footprint/ per_pad zone setings. I like proposal
> from Vesa for Zones_Inside_ Zone too. But this is not first thing in the
> list. I agree with Dick that thermals are not neccessary for SMT pads,
> but try to unsolder through hole component in 4 or more layer board.
>
> I do *not* like my idea about adding stubs after removal anymore. Too
> much truble.
>
> I would like too see stable release in february. TODO list is rather
> short of short term items to be done (for release).
>
> Rok
>
I think a stable release can be done in february.
For now, most important things are bug hunting and docs update
Zone enhancements will be made after.
--
Jean-Pierre CHARRAS
Maître de conférences
Directeur d'études 2ieme année.
Génie Electrique et Informatique Industrielle 2
Institut Universitaire de Technologie 1 de Grenoble
BP 67, 38402 St Martin d'Heres Cedex
Recherche :
GIPSA-LIS - INPG
Rue de la Houille Blanche
38400 Saint Martin d'Heres
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Rok Markovic a écrit :
<blockquote cite="mid:497AE13F.9090709@..." type="cite">
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<p>HI to all!<br>
<br>
Yes, Jean-Piere I agree with you - it is not the code problem, it is<br>
program problem. We have to tell users what each parameter means, but I<br>
have no idea how. I am familiar with code, but I still ned some thinking<br>
how to set parameters. Does anyone knows, how can we suggest to user how<br>
to set parameters (maybe some sort of image) ???<br>
<br>
I would like to see per_footprint/ per_pad zone setings. I like proposal<br>
from Vesa for Zones_Inside_ Zone too. But this is not first thing in the<br>
list. I agree with Dick that thermals are not neccessary for SMT pads,<br>
but try to unsolder through hole component in 4 or more layer board.<br>
<br>
I do *not* like my idea about adding stubs after removal anymore. Too<br>
much truble.<br>
<br>
I would like too see stable release in february. TODO list is rather<br>
short of short term items to be done (for release).<br>
<br>
Rok<br>
</p>
</div>
</div>
</div>
</blockquote>
I think a stable release can be done in february.<br>
For now, most important things are bug hunting and docs update<br>
<br>
Zone enhancements will be made after.<br>
<br>
<pre class="moz-signature" cols="72">--
Jean-Pierre CHARRAS
Maître de conférences
Directeur d'études 2ieme année.
Génie Electrique et Informatique Industrielle 2
Institut Universitaire de Technologie 1 de Grenoble
BP 67, 38402 St Martin d'Heres Cedex
Recherche :
GIPSA-LIS - INPG
Rue de la Houille Blanche
38400 Saint Martin d'Heres
</pre>
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