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Re: New Layers was: [Have you tried design spark?]
On 09/10/2010 05:10 PM, Karl Schmidt wrote:
> Brian F. G. Bidulock wrote:
>> I changed the integer layer number to a LAYER_ID with conversion to and
>> from int and the bit mask to a LAYER_SET with overloaded bit mask
>> operators. The number of copper layers is now rather arbitrary (some
>> New layers added are Plating, HoleFill, KeepOut, ViaPlug, Contacts,
>> PeelMask, Finish, Courtyard, Component, Coating, Probe, Fixture.
> There was a distinction between copper layers and tech layers - I'm assuming these are all 'tech
> layers'? or is this still a valid distinction?
> I put it on my wiki - can you check that I'm not misleading?
> (also note my comments there about copper = solder-side and component = front side (Many boards have
> parts on both front and back.) can we use better nomenclature?
I thought I had mostly killed off the copper and component words in
favor of 'front' and 'back' for the copper layers, at least that was my
Karl, can you say where this still shows up in the UI, or is this just
some ancient wiki folklore?