kicad-developers team mailing list archive

[Vesa Solonen <vsolonen@xxxxxxxxx>]

On Mon, 6 Dec 2010, jean-pierre charras wrote:

> Pay a particular attention to a new filling zone algorithm.
> I need volunteers to test this algorithm and know if it is better than the 
> current one (i.e. if no issue found).
New fill leaves thermal stubs between SO-package pins, that old fill did 
not. In the old stub-removal code there was some fudge factor for corner 
cases if I remember correctly. So maybe the new version is just more 
accurate. I havent looked at the code, but the stub issue is annoying and 
may need too much work to solve properly for this release. Logic to 
prevent stubs is something like "no thermals to islands smaller than 
minimum width squared" or so. This issue doesn't seem to violate design 
specification, but definitely worsens manufacturability.
-Vesa