kicad-developers team mailing list archive

[Janis Skujenieks <janis.skujenieks@xxxxxxxxx>]

I will bring this up once more.

Are there any more opinions on this?

This is weird that nobody else feels this very inconvenient. How the rest
of you place stand alone via. I need this quite often. On the other hand if
this kind of feature is not supported, pcbnew shouldn't allow to start
track on copper filled areas. Actually this is exactly how I do it now.
When rest is routed, I fill zones with copper and then place vias, starting
track anywhere on filled zone.

On Thu, Feb 9, 2012 at 10:47 PM, Dick Hollenbeck <dick@xxxxxxxxxxx> wrote:

> On 02/09/2012 01:51 PM, Brian F. G. Bidulock wrote:
> > Dick,
> >
> > On Thu, 09 Feb 2012, Dick Hollenbeck wrote:
> >> Clever, and with different orientation of the pad pair, I suppose you
> can accurately
> >> control the spacing between the pair as you go.  ?
> > Yup.  And copying this GAP module retains the netnames on the pads so
> that
> > one can position them ahead of where you want to lay the pair.  I put one
> > at the edge of the breakout region of a BGA so that I can get wild from
> > there.
> >
> > --brian
>
> I did something vaguely similar under a BGA with VIAs.
>
> In the footprint editor, when developing a BGA footprint, I placed through
> hole pads also,
> on grid, each nearby a ball pad by the same name.  Then with the proper
> solder mask
> setting, and pad name same as the nearby SMT ball pad, I was able to
> convert those through
> holes effectively into pre-placed vias.
>
> Then during routing you had some help in tying into the something that
> would help with the
> fan out.
>
> Some day it would be nice if the "module editor" could actually edit
> modules, rather than
> mere footprints.  Where module equals the pads and the fan out traces.
>
>
>
>
>
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