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Re: Simplified vias patch proposal


2012/6/28 Lorenzo Marcantonio <l.marcantonio@xxxxxxxxxxxx>

> On Thu, Jun 28, 2012 at 02:50:51PM +0200, Miguel Angel Ajo Pelayo wrote:
> > *this can cause trouble at manufacturing if not well handled but it's a
> > good way to reduce parasitic impedance*.
> You need to make sure that solder paste stays on the pad and don't go
> down the via. It's also used with BGAs in a (somewhat expensive) process
> called 'pads on via'

Yes, that's what I meaned, you can tempt the vias in the other side, and if
they are small
enough no paste will pass. But tempting vias won't be good if your purpose
was thermal.

> IIRC there is nothing in the drc which block 'colliding' components (we
> don't either have courtyard information to do that) so it should work
> without problem.

Nice then, but it will be something to care about if it's implemented at
any time.

> --
> Lorenzo Marcantonio
> Logos Srl
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Miguel Angel Ajo Pelayo
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skype: ajoajoajo

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