kicad-developers team mailing list archive

[Opendous Support <opendous.support@xxxxxxxxx>]

  As mentioned, having via modules solves all via problems but
introduces extra work for the designer.  When manually routing the
ability to play with via placement is critical so it is usually worth
it.

  What about changing the via system so that all vias behave like
1-pin modules (footprints) by retaining their netlist and customizable
pin properties?

P.S  https://bugs.launchpad.net/kicad/+bug/594090
P.P.S  The idea to introduce a zone filler that fills zones with vias is great.

On Thu, Jun 28, 2012 at 9:02 AM, Miguel Angel Ajo Pelayo
<miguelangel@xxxxxxx> wrote:
> 2012/6/28 Lorenzo Marcantonio <l.marcantonio@xxxxxxxxxxxx>
>>
>> On Thu, Jun 28, 2012 at 02:50:51PM +0200, Miguel Angel Ajo Pelayo wrote:
>> > *this can cause trouble at manufacturing if not well handled but it's a
>> > good way to reduce parasitic impedance*.
>>
>> You need to make sure that solder paste stays on the pad and don't go
>> down the via. It's also used with BGAs in a (somewhat expensive) process
>> called 'pads on via'
>
>
> Yes, that's what I meaned, you can tempt the vias in the other side, and if
> they are small
> enough no paste will pass. But tempting vias won't be good if your purpose
> was thermal.
>
>
>>
>> IIRC there is nothing in the drc which block 'colliding' components (we
>> don't either have courtyard information to do that) so it should work
>> without problem.
>
>
> Nice then, but it will be something to care about if it's implemented at any
> time.
>
>
>
>
>>
>> --
>> Lorenzo Marcantonio
>> Logos Srl
>>
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>
>
>
>
> --
>
> Miguel Angel Ajo Pelayo
> http://www.nbee.es
> +34 636 52 25 69
> skype: ajoajoajo
>
> _______________________________________________
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