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Message #13753
Re: thermal pads
On Mon, Jun 23, 2014 at 09:28:20AM +0200, jp charras wrote:
> PAD_CONN type was initially just a PAD_SMD with no solder paste (just
> because a edge connector pad needs only a NiAu plating).
PAD_CONN as a separate type IMHO has no reason to exists exactly because
is a simple smd pad without a layer, i.e. has no special behaviour
attached to it...
I'd suggest to simply remove it as a pad type and convert it to an SMD
pad (unless of course there actually is a place where PAD_CONN has
a different semantic than PAD_SMD). grep would help here :P
--
Lorenzo Marcantonio
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