kicad-developers team mailing list archive

[Dick Hollenbeck <dick@xxxxxxxxxxx>]

On 06/23/2014 02:45 AM, Lorenzo Marcantonio wrote:
> On Mon, Jun 23, 2014 at 09:28:20AM +0200, jp charras wrote:
>> PAD_CONN type was initially just a PAD_SMD with no solder paste (just
>> because a edge connector pad needs only a NiAu plating).
> 
> PAD_CONN as a separate type IMHO has no reason to exists exactly because
> is a simple smd pad without a layer, i.e. has no special behaviour
> attached to it...
> 
> I'd suggest to simply remove it as a pad type and convert it to an SMD
> pad (unless of course there actually is a place where PAD_CONN has
> a different semantic than PAD_SMD). grep would help here :P
> 

Astonishingly, I tend to agree.

Why does PAD_CONN deserve a life and not PAD_THERMAL?  When does it end?