kicad-developers team mailing list archive

[Dick Hollenbeck <dick@xxxxxxxxxxx>]

On 08/13/2014 10:07 AM, Wayne Stambaugh wrote:
> On 8/11/2014 10:24 PM, Dick Hollenbeck wrote:
>> We got any of these in our part or footprint libraries?
>>
>> http://www.johansondielectrics.com/technical-notes/x2y-application-notes/x2y-power-bypass-pcb-mounting.html#.U-l5WtZGlO4
>>
>>
> 
> I haven't seen any footprint like what is shown.  I've done similar
> footprints for handling multiple wire sizes although all of the
> connected pads are round and through hole so it should be doable
> although I've never tried mixing SMT and through hole pads to create a
> complex pad.  Thanks for the link.  There is a lot of good information
> there.  


> Although, I doubt I will ever have to worry about a couple of pF
> of bypass inductance in any of my designs.


Mr. Henry would be insulted.  :)


There were all kinds of papers on them in 2006.  It seems to be an example of the patent
system actually working like it was intended.  With the x2y caps, if they can claim lower
BOM cost, and higher performance, that is a win in my book.

An Altera reference design has them in there.  That means if I stray from their
recommendation, and the board does not work, I'm toast.

Seems I will need to make the parts and the footprints.  Veecandoodat.