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Message #15032
Re: [PATCH] Rename instances of "module" to "footprint" for consistency
Second the vote for consistency, no matter which way it goes.
Personally, I have a slight preference for "footprint" over "module" as
well.
On Wed, 2014-10-08 at 18:56 +1100, Mitch Davis wrote:
> On Wed, Oct 8, 2014 at 5:47 PM, Mark Roszko <mark.roszko@xxxxxxxxx> wrote:
> > Hehe, well, I guess everything can be renamed in the opposite
> > direction. But consistency is needed.
>
> YES PLEASE! A number of people I've spoken to were really confused by
> this inconsistency.
>
> I use footprint myself. Though footprint seems to imply what a PCB
> must have in order to accommodate a part, eg, pads, silk. Are the 3d
> models part of this? If they are, then footprint might not be the
> best term.
>
> Mitch.
>
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--
Andrew Zonenberg
PhD student, security group
Computer Science Department
Rensselaer Polytechnic Institute
http://colossus.cs.rpi.edu/~azonenberg/
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