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Re: [PATCH] Rename instances of "module" to "footprint" for consistency

 

Second the vote for consistency, no matter which way it goes.

Personally, I have a slight preference for "footprint" over "module" as
well.

On Wed, 2014-10-08 at 18:56 +1100, Mitch Davis wrote:
> On Wed, Oct 8, 2014 at 5:47 PM, Mark Roszko <mark.roszko@xxxxxxxxx> wrote:
> > Hehe, well, I guess everything can be renamed in the opposite
> > direction. But consistency is needed.
> 
> YES PLEASE!  A number of people I've spoken to were really confused by
> this inconsistency.
> 
> I use footprint myself.  Though footprint seems to imply what a PCB
> must have in order to accommodate a part, eg, pads, silk.  Are the 3d
> models part of this?  If they are, then footprint might not be the
> best term.
> 
> Mitch.
> 
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-- 
Andrew Zonenberg
PhD student, security group
Computer Science Department
Rensselaer Polytechnic Institute
http://colossus.cs.rpi.edu/~azonenberg/

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