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Fwd: kicad issues

 


-------- Forwarded Message --------
Subject: 	kicad bazaar
Date: 	Mon, 16 Feb 2015 09:24:47 -0800
From: 	Viktor Schoeggl <gxgx216@xxxxxxxxx>
To: 	stranger@xxxxxxxxxx

To whom it may concern.

While creating my first two kicad footprints using the recently relased
version, "KiCad_testing-2015.01.17-BZR5376_Win_full_ version.exe", two
critical issues are apparent:


 1.

    KiCad makes or prints the wrong sized footprints and,

 2.

    There is a much easier way to make Surface Mount Device SMD or T.H.
    footprints for the bottom copper layer than is presently used.

    It is hoped that the following set of observations and means to
    reproduce the issues will shorten the turn-around time to the next
    better release which I am eagerly anticipating. I hope you
    appreciate my concerns with these two issues that crucially limit
    the usefulness of Kicad. Hopefully this information and the attached
    *.kicad_mod files will save someone troubleshooting time and quickly
    improve KiCad.

*Summary of issue one:* The printed footprint size varies depending on
which of the three different printing options are used, namely: 1)
printing the footprint from the footprint editor, 2) printing the
footprint from PCBNew, or 3) printing the gerber file. Footprint sizes
are off by around 1/2 pad width making the footprints useless. It is
also possible that the chioce of paper affects the outcome but as the
gerber printing doesnt even have the option for the standard 8 1/2 x 11,
legal, of 11 x 17 inch paper the printers use, this wasn't looked into.


*Method:* Make and print a DDR2 SODIMM memory scocket, 0.6mm pitch, 1/2
pitch offset between the two sides of 100 contacts per side starting
with the SOIC wizard making a 212 pad footprint. DDR2 SODIMM data sheets
attached. Part 1565917-4 is used for check but datasheet for 292407 is
better documented. Three iterations of the footprint were required to
clue into the issue. First footprint is made in the editor with a 0.6 mm
pitch and printed from PCBNew with the rest of the pcb; the printed
footprint is 1/4 pad shorter than the physical socket. A second
footprint is made on a 0.60206 mm pitch and printed directly from the
footprint editor; the printed footprint is 1/4 pad longer than the
physical socket. A third footprint is made on a 0.598 mm pitch and
printed from PCBNew with the rest of the pcb; finally the footprint
matches the physical socket. Then I printed it from the footprint editor
and it was off again. At this point it was apparent that the footprint
size depends on which way it is printed. At this point the various
combinations of printing was tried


*Observations: * The following table summarizes the relations of the
three attached footprints (*.kicad_mod files) depending on how they are
printed. The entries are meant to finish the following sentance.

The printed footprint is (too) .....


Footprint name *.kicad_mod

	

Pitch (mm)

	

Printed from editor

	

Printed from PCBNew

	

Printed from gerber

mod_soic_212

	

0.60000

	

correct

	

short by 1/4 pad

	

long by 1/2 pad

ddr2_sodimm_200_v

	

0.60206

	

long by 1/4 pad

	

long by 2/3 pad

	

long by 1/2 pad

ddr-200

	

0.59800

	

Short by 1/2 pad

	

correct

	

Short by 1/2 pad



*Conclusion 1: *Thats all the info**on this issue at present. Hope it is
helpful.



*Summary of issue two: *Although it is possible to make a SMD footprint
on the bottom copper, it requires the engineer to mirror everything
relative to the data sheets that show the top view. Even if one could do
this without making errors (not too likely) it would require that you
keep a whole set of bottom copper footprints that are mirrored from the
top copper footprints. Obviously this is an error prone way to double
the list of footprints and at least doublr the engineering time used.
You have already done the software to mirror the text if you put the
component text onto the bottom side. All that is needed is a change to
CvPcb. Having a checkbox or toggled setting of "top layer"(default) or
"bottom layer" beside each chosen footprint in CvPcb would allow for
easily showing the mirrored version of the through-hole or SMD footprint
while looking at the usual "through pcb" view of the layout and the
silkscreens are thus automatically handlled too.


*Conclusion of issue two:*Saving the time, errors, and doubled number of
footprints seems to me to make having a layer select in CvPcb very
worthwhile since most every pcb ends up with connectors or whatever that
has to go on the bottom layer.



Thanks for your consideration of these issues. If I have made mistakes
having just started evaluating kicad as a beginner, please accept my
appologies in advance. Please mention if there is anything else you need
in this respect. I look foreward to a revised version.

viktor





the three footprints used are:

(module 0_VS_Footprints:DDR2_SODIMM_200_V (layer F.Cu) (tedit 54C7E176)
   (fp_text reference J** (at -18.69436 -0.58321 180) (layer F.SilkS)
     (effects (font (size 1.2 1.2) (thickness 0.2)))
   )
   (fp_text value DDR2_SODIMM_200 (at -17.5 1.3447 180) (layer F.SilkS)
     (effects (font (size 1.2 1.2) (thickness 0.2)))
   )
   (fp_line (start 3.5 37.5) (end 5.5 35.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -1.5 35.5) (end 1.5 35.5) (layer F.SilkS) (width 0.15))
(fp_line (start -0.5 -32.5) (end 0.5 -32.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -36 -29.5) (end -36 -27.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -36 -29.5) (end -34 -29.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -36 32.5) (end -34 32.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -36 32.5) (end -36 30.5) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 37.5) (end -41 37.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -41 37.5) (end -41 -34.5) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 -34.5) (end -41 -34.5) (layer F.SilkS) (width 0.15))
   (fp_line (start 0 37.5) (end 0 35.5) (layer F.SilkS) (width 0.15))
   (fp_line (start 0 -34.5) (end 0 -32.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -3.5 -34.5) (end -3.5 -31) (layer F.SilkS) (width 0.15))
   (fp_line (start -3.5 37.5) (end -3.5 34) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 37.5) (end 5.5 -34.5) (layer F.SilkS) (width 0.15))
   (pad 1 smd rect (at 4 33.41921 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 3 smd rect (at 4 32.81715 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 5 smd rect (at 4 32.21509 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 7 smd rect (at 4 31.61303 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 9 smd rect (at 4 31.01097 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 11 smd rect (at 4 30.40891 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 13 smd rect (at 4 29.80685 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 15 smd rect (at 4 29.20479 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 17 smd rect (at 4 28.60273 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 19 smd rect (at 4 28.00067 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 21 smd rect (at 4 27.39861 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 23 smd rect (at 4 26.79655 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 25 smd rect (at 4 26.19449 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 27 smd rect (at 4 25.59243 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 29 smd rect (at 4 24.99037 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 31 smd rect (at 4 24.38831 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 33 smd rect (at 4 23.78625 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 35 smd rect (at 4 23.18419 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 37 smd rect (at 4 22.58213 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 39 smd rect (at 4 21.98007 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 41 smd rect (at 4 17.76565 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 43 smd rect (at 4 17.16359 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 45 smd rect (at 4 16.56153 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 47 smd rect (at 4 15.95947 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 49 smd rect (at 4 15.35741 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 51 smd rect (at 4 14.75535 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 53 smd rect (at 4 14.15329 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 55 smd rect (at 4 13.55123 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 57 smd rect (at 4 12.94917 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 59 smd rect (at 4 12.34711 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 61 smd rect (at 4 11.74505 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 63 smd rect (at 4 11.14299 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 65 smd rect (at 4 10.54093 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 67 smd rect (at 4 9.93887 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 69 smd rect (at 4 9.33681 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 71 smd rect (at 4 8.73475 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 73 smd rect (at 4 8.13269 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 75 smd rect (at 4 7.53063 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 77 smd rect (at 4 6.92857 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 79 smd rect (at 4 6.32651 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 81 smd rect (at 4 5.72445 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 83 smd rect (at 4 5.12239 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 85 smd rect (at 4 4.52033 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 87 smd rect (at 4 3.91827 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 89 smd rect (at 4 3.31621 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 91 smd rect (at 4 2.71415 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 93 smd rect (at 4 2.11209 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 95 smd rect (at 4 1.51003 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 97 smd rect (at 4 0.90797 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 99 smd rect (at 4 0.30591 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 101 smd rect (at 4 -0.29615 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 103 smd rect (at 4 -0.89821 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 105 smd rect (at 4 -1.50027 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 107 smd rect (at 4 -2.10233 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 109 smd rect (at 4 -2.70439 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 111 smd rect (at 4 -3.30645 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 113 smd rect (at 4 -3.90851 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 115 smd rect (at 4 -4.51057 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 117 smd rect (at 4 -5.11263 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 119 smd rect (at 4 -5.71469 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 121 smd rect (at 4 -6.31675 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 123 smd rect (at 4 -6.91881 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 125 smd rect (at 4 -7.52087 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 127 smd rect (at 4 -8.12293 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 129 smd rect (at 4 -8.72499 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 131 smd rect (at 4 -9.32705 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 133 smd rect (at 4 -9.92911 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 135 smd rect (at 4 -10.53117 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 137 smd rect (at 4 -11.13323 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 139 smd rect (at 4 -11.73529 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 141 smd rect (at 4 -12.33735 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 143 smd rect (at 4 -12.93941 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 145 smd rect (at 4 -13.54147 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 147 smd rect (at 4 -14.14353 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 149 smd rect (at 4 -14.74559 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 151 smd rect (at 4 -15.34765 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 153 smd rect (at 4 -15.94971 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 155 smd rect (at 4 -16.55177 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 157 smd rect (at 4 -17.15383 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 159 smd rect (at 4 -17.75589 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 161 smd rect (at 4 -18.35795 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 163 smd rect (at 4 -18.96001 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 165 smd rect (at 4 -19.56207 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 167 smd rect (at 4 -20.16413 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 169 smd rect (at 4 -20.76619 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 171 smd rect (at 4 -21.36825 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 173 smd rect (at 4 -21.97031 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 175 smd rect (at 4 -22.57237 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 177 smd rect (at 4 -23.17443 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 179 smd rect (at 4 -23.77649 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 181 smd rect (at 4 -24.37855 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 183 smd rect (at 4 -24.98061 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 185 smd rect (at 4 -25.58267 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 187 smd rect (at 4 -26.18473 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 189 smd rect (at 4 -26.78679 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 191 smd rect (at 4 -27.38885 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 193 smd rect (at 4 -27.99091 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 195 smd rect (at 4 -28.59297 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 197 smd rect (at 4 -29.19503 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 199 smd rect (at 4 -29.79709 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 2 smd rect (at -4 33.11818 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 4 smd rect (at -4 32.51612 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 6 smd rect (at -4 31.91406 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 8 smd rect (at -4 31.312 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 10 smd rect (at -4 30.70994 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 12 smd rect (at -4 30.10788 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 14 smd rect (at -4 29.50582 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 16 smd rect (at -4 28.90376 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 18 smd rect (at -4 28.3017 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 20 smd rect (at -4 27.69964 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 22 smd rect (at -4 27.09758 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 24 smd rect (at -4 26.49552 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 26 smd rect (at -4 25.89346 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 28 smd rect (at -4 25.2914 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 30 smd rect (at -4 24.68934 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 32 smd rect (at -4 24.08728 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 34 smd rect (at -4 23.48522 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 36 smd rect (at -4 22.88316 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 38 smd rect (at -4 22.2811 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 40 smd rect (at -4 21.67904 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 42 smd rect (at -4 17.46462 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 44 smd rect (at -4 16.86256 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 46 smd rect (at -4 16.2605 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 48 smd rect (at -4 15.65844 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 50 smd rect (at -4 15.05638 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 52 smd rect (at -4 14.45432 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 54 smd rect (at -4 13.85226 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 56 smd rect (at -4 13.2502 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 58 smd rect (at -4 12.64814 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 60 smd rect (at -4 12.04608 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 62 smd rect (at -4 11.44402 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 64 smd rect (at -4 10.84196 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 66 smd rect (at -4 10.2399 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 68 smd rect (at -4 9.63784 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 70 smd rect (at -4 9.03578 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 72 smd rect (at -4 8.43372 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 74 smd rect (at -4 7.83166 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 76 smd rect (at -4 7.2296 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 78 smd rect (at -4 6.62754 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 80 smd rect (at -4 6.02548 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 82 smd rect (at -4 5.42342 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 84 smd rect (at -4 4.82136 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 86 smd rect (at -4 4.2193 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 88 smd rect (at -4 3.61724 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 90 smd rect (at -4 3.01518 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 92 smd rect (at -4 2.41312 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 94 smd rect (at -4 1.81106 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 96 smd rect (at -4 1.209 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 98 smd rect (at -4 0.60694 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 100 smd rect (at -4 0.00488 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 102 smd rect (at -4 -0.59718 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 104 smd rect (at -4 -1.19924 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 106 smd rect (at -4 -1.8013 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 108 smd rect (at -4 -2.40336 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 110 smd rect (at -4 -3.00542 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 112 smd rect (at -4 -3.60748 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 114 smd rect (at -4 -4.20954 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 116 smd rect (at -4 -4.8116 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 118 smd rect (at -4 -5.41366 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 120 smd rect (at -4 -6.01572 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 122 smd rect (at -4 -6.61778 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 124 smd rect (at -4 -7.21984 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 126 smd rect (at -4 -7.8219 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 128 smd rect (at -4 -8.42396 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 130 smd rect (at -4 -9.02602 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 132 smd rect (at -4 -9.62808 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 134 smd rect (at -4 -10.23014 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 136 smd rect (at -4 -10.8322 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 138 smd rect (at -4 -11.43426 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 140 smd rect (at -4 -12.03632 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 142 smd rect (at -4 -12.63838 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 144 smd rect (at -4 -13.24044 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 146 smd rect (at -4 -13.8425 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 148 smd rect (at -4 -14.44456 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 150 smd rect (at -4 -15.04662 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 152 smd rect (at -4 -15.64868 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 154 smd rect (at -4 -16.25074 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 156 smd rect (at -4 -16.8528 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 158 smd rect (at -4 -17.45486 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 160 smd rect (at -4 -18.05692 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 162 smd rect (at -4 -18.65898 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 164 smd rect (at -4 -19.26104 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 166 smd rect (at -4 -19.8631 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 168 smd rect (at -4 -20.46516 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 170 smd rect (at -4 -21.06722 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 172 smd rect (at -4 -21.66928 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 174 smd rect (at -4 -22.27134 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 176 smd rect (at -4 -22.8734 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 178 smd rect (at -4 -23.47546 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 180 smd rect (at -4 -24.07752 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 182 smd rect (at -4 -24.67958 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 184 smd rect (at -4 -25.28164 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 186 smd rect (at -4 -25.8837 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 188 smd rect (at -4 -26.48576 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 190 smd rect (at -4 -27.08782 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 192 smd rect (at -4 -27.68988 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 194 smd rect (at -4 -28.29194 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 196 smd rect (at -4 -28.894 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 198 smd rect (at -4 -29.49606 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 200 smd rect (at -4 -30.09812 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 201 smd rect (at -12 35) (size 5 5) (layers F.Cu F.Paste F.Mask))
   (pad 202 smd rect (at -12 -32) (size 5 5) (layers F.Cu F.Paste F.Mask))
)

(module 0_VS_Footprints:DDR-200 (layer F.Cu) (tedit 54E0E475)
   (fp_text reference J** (at -15.05 -1.85 180) (layer F.SilkS)
     (effects (font (size 1.2 1.2) (thickness 0.2)))
   )
   (fp_text value DDR_200 (at -12.35 1.35 180) (layer F.SilkS)
     (effects (font (size 1.2 1.2) (thickness 0.2)))
   )
   (fp_line (start -1.5 34) (end 1.5 34) (layer F.SilkS) (width 0.15))
   (fp_line (start -3.5 36) (end -3.5 32.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -36 29) (end -36 31) (layer F.SilkS) (width 0.15))
   (fp_line (start -36 31) (end -34 31) (layer F.SilkS) (width 0.15))
   (fp_line (start -34 -31) (end -36 -31) (layer F.SilkS) (width 0.15))
   (fp_line (start -36 -31) (end -36 -29) (layer F.SilkS) (width 0.15))
   (fp_line (start -14.5 36) (end -41 36) (layer F.SilkS) (width 0.15))
   (fp_line (start -41 36) (end -41 -36) (layer F.SilkS) (width 0.15))
   (fp_line (start -14.5 -36) (end -41 -36) (layer F.SilkS) (width 0.15))
   (fp_line (start -3.5 -36) (end -3.5 -32.5) (layer F.SilkS) (width 0.15))
   (fp_line (start -0.5 -34) (end 0.5 -34) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 36) (end 0 36) (layer F.SilkS) (width 0.15))
   (fp_line (start 0 36) (end 0 34) (layer F.SilkS) (width 0.15))
   (fp_line (start 0 34) (end 0 36) (layer F.SilkS) (width 0.15))
   (fp_line (start 0 36) (end -14.5 36) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 36) (end 5.5 -36) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 -36) (end 0 -36) (layer F.SilkS) (width 0.15))
   (fp_line (start 0 -36) (end 0 -34) (layer F.SilkS) (width 0.15))
   (fp_line (start 0 -34) (end 0 -36) (layer F.SilkS) (width 0.15))
   (fp_line (start 0 -36) (end -14.5 -36) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 -25.55) (end -7 -25.55) (layer F.SilkS) (width
0.15))
   (fp_line (start -5.5 -19.6) (end -7 -19.6) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 -13.6) (end -7 -13.6) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 -7.65) (end -7 -7.65) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 -1.65) (end -7 -1.65) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 -31.6) (end -7 -31.6) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 -31.25) (end 7 -31.25) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 -25.3) (end 7 -25.3) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 -19.3) (end 7 -19.3) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 -13.35) (end 7 -13.35) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 -7.3) (end 7 -7.3) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 -1.35) (end 7 -1.35) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 4.65) (end 7 4.65) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 4.35) (end -7 4.35) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 10.6) (end 7 10.6) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 10.35) (end -7 10.35) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 19.85) (end -7 19.85) (layer F.SilkS) (width 0.15))
   (fp_line (start -5.5 25.8) (end -7 25.8) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 20.2) (end 7 20.2) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 26.15) (end 7 26.15) (layer F.SilkS) (width 0.15))
   (fp_line (start 5.5 31.5) (end 7 31.2) (layer F.SilkS) (width 0.15))
   (fp_line (start 7 31.2) (end 7 31.8) (layer F.SilkS) (width 0.15))
   (fp_line (start 7 31.8) (end 5.5 31.5) (layer F.SilkS) (width 0.15))
   (pad 1 smd rect (at 4 31.545 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 3 smd rect (at 4 30.947 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 5 smd rect (at 4 30.349 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 7 smd rect (at 4 29.751 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 9 smd rect (at 4 29.153 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 11 smd rect (at 4 28.555 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 13 smd rect (at 4 27.957 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 15 smd rect (at 4 27.359 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 17 smd rect (at 4 26.761 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 19 smd rect (at 4 26.163 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 21 smd rect (at 4 25.565 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 23 smd rect (at 4 24.967 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 25 smd rect (at 4 24.369 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 27 smd rect (at 4 23.771 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 29 smd rect (at 4 23.173 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 31 smd rect (at 4 22.575 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 33 smd rect (at 4 21.977 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 35 smd rect (at 4 21.379 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 37 smd rect (at 4 20.781 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 39 smd rect (at 4 20.183 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 41 smd rect (at 4 15.997 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 43 smd rect (at 4 15.399 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 45 smd rect (at 4 14.801 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 47 smd rect (at 4 14.203 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 49 smd rect (at 4 13.605 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 51 smd rect (at 4 13.007 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 53 smd rect (at 4 12.409 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 55 smd rect (at 4 11.811 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 57 smd rect (at 4 11.213 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 59 smd rect (at 4 10.615 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 61 smd rect (at 4 10.017 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 63 smd rect (at 4 9.419 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 65 smd rect (at 4 8.821 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 67 smd rect (at 4 8.223 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 69 smd rect (at 4 7.625 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 71 smd rect (at 4 7.027 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 73 smd rect (at 4 6.429 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 75 smd rect (at 4 5.831 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 77 smd rect (at 4 5.233 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 79 smd rect (at 4 4.635 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 81 smd rect (at 4 4.037 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 83 smd rect (at 4 3.439 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 85 smd rect (at 4 2.841 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 87 smd rect (at 4 2.243 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 89 smd rect (at 4 1.645 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 91 smd rect (at 4 1.047 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 93 smd rect (at 4 0.449 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 95 smd rect (at 4 -0.149 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 97 smd rect (at 4 -0.747 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 99 smd rect (at 4 -1.345 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 101 smd rect (at 4 -1.943 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 103 smd rect (at 4 -2.541 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 105 smd rect (at 4 -3.139 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 107 smd rect (at 4 -3.737 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 109 smd rect (at 4 -4.335 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 111 smd rect (at 4 -4.933 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 113 smd rect (at 4 -5.531 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 115 smd rect (at 4 -6.129 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 117 smd rect (at 4 -6.727 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 119 smd rect (at 4 -7.325 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 121 smd rect (at 4 -7.923 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 123 smd rect (at 4 -8.521 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 125 smd rect (at 4 -9.119 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 127 smd rect (at 4 -9.717 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 129 smd rect (at 4 -10.315 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 131 smd rect (at 4 -10.913 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 133 smd rect (at 4 -11.511 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 135 smd rect (at 4 -12.109 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 137 smd rect (at 4 -12.707 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 139 smd rect (at 4 -13.305 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 141 smd rect (at 4 -13.903 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 143 smd rect (at 4 -14.501 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 145 smd rect (at 4 -15.099 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 147 smd rect (at 4 -15.697 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 149 smd rect (at 4 -16.295 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 151 smd rect (at 4 -16.893 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 153 smd rect (at 4 -17.491 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 155 smd rect (at 4 -18.089 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 157 smd rect (at 4 -18.687 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 159 smd rect (at 4 -19.285 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 161 smd rect (at 4 -19.883 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 163 smd rect (at 4 -20.481 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 165 smd rect (at 4 -21.079 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 167 smd rect (at 4 -21.677 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 169 smd rect (at 4 -22.275 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 171 smd rect (at 4 -22.873 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 173 smd rect (at 4 -23.471 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 175 smd rect (at 4 -24.069 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 177 smd rect (at 4 -24.667 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 179 smd rect (at 4 -25.265 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 181 smd rect (at 4 -25.863 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 183 smd rect (at 4 -26.461 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 185 smd rect (at 4 -27.059 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 187 smd rect (at 4 -27.657 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 189 smd rect (at 4 -28.255 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 191 smd rect (at 4 -28.853 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 193 smd rect (at 4 -29.451 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 195 smd rect (at 4 -30.049 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 197 smd rect (at 4 -30.647 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 199 smd rect (at 4 -31.245 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 2 smd rect (at -4 31.245 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 4 smd rect (at -4 30.647 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 6 smd rect (at -4 30.049 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 8 smd rect (at -4 29.451 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 10 smd rect (at -4 28.853 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 12 smd rect (at -4 28.255 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 14 smd rect (at -4 27.657 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 16 smd rect (at -4 27.059 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 18 smd rect (at -4 26.461 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 20 smd rect (at -4 25.863 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 22 smd rect (at -4 25.265 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 24 smd rect (at -4 24.667 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 26 smd rect (at -4 24.069 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 28 smd rect (at -4 23.471 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 30 smd rect (at -4 22.873 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 32 smd rect (at -4 22.275 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 34 smd rect (at -4 21.677 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 36 smd rect (at -4 21.079 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 38 smd rect (at -4 20.481 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 40 smd rect (at -4 19.883 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 42 smd rect (at -4 15.697 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 44 smd rect (at -4 15.099 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 46 smd rect (at -4 14.501 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 48 smd rect (at -4 13.903 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 50 smd rect (at -4 13.305 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 52 smd rect (at -4 12.707 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 54 smd rect (at -4 12.109 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 56 smd rect (at -4 11.511 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 58 smd rect (at -4 10.913 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 60 smd rect (at -4 10.315 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 62 smd rect (at -4 9.717 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 64 smd rect (at -4 9.119 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 66 smd rect (at -4 8.521 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 68 smd rect (at -4 7.923 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 70 smd rect (at -4 7.325 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 72 smd rect (at -4 6.727 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 74 smd rect (at -4 6.129 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 76 smd rect (at -4 5.531 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 78 smd rect (at -4 4.933 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 80 smd rect (at -4 4.335 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 82 smd rect (at -4 3.737 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 84 smd rect (at -4 3.139 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 86 smd rect (at -4 2.541 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 88 smd rect (at -4 1.943 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 90 smd rect (at -4 1.345 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 92 smd rect (at -4 0.747 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 94 smd rect (at -4 0.149 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 96 smd rect (at -4 -0.449 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 98 smd rect (at -4 -1.047 180) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 100 smd rect (at -4 -1.645 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 102 smd rect (at -4 -2.243 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 104 smd rect (at -4 -2.841 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 106 smd rect (at -4 -3.439 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 108 smd rect (at -4 -4.037 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 110 smd rect (at -4 -4.635 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 112 smd rect (at -4 -5.233 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 114 smd rect (at -4 -5.831 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 116 smd rect (at -4 -6.429 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 118 smd rect (at -4 -7.027 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 120 smd rect (at -4 -7.625 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 122 smd rect (at -4 -8.223 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 124 smd rect (at -4 -8.821 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 126 smd rect (at -4 -9.419 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 128 smd rect (at -4 -10.017 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 130 smd rect (at -4 -10.615 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 132 smd rect (at -4 -11.213 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 134 smd rect (at -4 -11.811 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 136 smd rect (at -4 -12.409 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 138 smd rect (at -4 -13.007 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 140 smd rect (at -4 -13.605 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 142 smd rect (at -4 -14.203 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 144 smd rect (at -4 -14.801 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 146 smd rect (at -4 -15.399 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 148 smd rect (at -4 -15.997 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 150 smd rect (at -4 -16.595 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 152 smd rect (at -4 -17.193 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 154 smd rect (at -4 -17.791 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 156 smd rect (at -4 -18.389 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 158 smd rect (at -4 -18.987 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 160 smd rect (at -4 -19.585 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 162 smd rect (at -4 -20.183 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 164 smd rect (at -4 -20.781 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 166 smd rect (at -4 -21.379 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 168 smd rect (at -4 -21.977 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 170 smd rect (at -4 -22.575 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 172 smd rect (at -4 -23.173 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 174 smd rect (at -4 -23.771 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 176 smd rect (at -4 -24.369 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 178 smd rect (at -4 -24.967 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 180 smd rect (at -4 -25.565 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 182 smd rect (at -4 -26.163 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 184 smd rect (at -4 -26.761 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 186 smd rect (at -4 -27.359 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 188 smd rect (at -4 -27.957 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 190 smd rect (at -4 -28.555 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 192 smd rect (at -4 -29.153 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 194 smd rect (at -4 -29.751 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 196 smd rect (at -4 -30.349 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 198 smd rect (at -4 -30.947 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 200 smd rect (at -4 -31.545 180) (size 2 0.3) (layers F.Cu
F.Paste F.Mask))
   (pad 201 smd rect (at -11.7 33.55 180) (size 5 5) (layers F.Cu
F.Paste F.Mask))
   (pad 202 smd rect (at -11.8 -33.4 180) (size 5 5) (layers F.Cu
F.Paste F.Mask))
)


(module 0_VS_Footprints:MOD_SOIC_212 (layer F.Cu) (tedit 54E12DCE)
   (fp_text reference U** (at 0 33.35) (layer F.SilkS)
     (effects (font (size 1.2 1.2) (thickness 0.2)))
   )
   (fp_text value MOD_SOIC_212 (at 0 -33.35) (layer F.SilkS)
     (effects (font (size 1.2 1.2) (thickness 0.2)))
   )
   (fp_line (start -4.5 -32.15) (end -5.5 -31.15) (layer F.SilkS) (width
0.2))
   (fp_line (start -5.5 -31.15) (end -5.5 32.15) (layer F.SilkS) (width
0.2))
   (fp_line (start -5.5 32.15) (end 5.5 32.15) (layer F.SilkS) (width 0.2))
   (fp_line (start 5.5 32.15) (end 5.5 -32.15) (layer F.SilkS) (width 0.2))
   (fp_line (start 5.5 -32.15) (end -4.5 -32.15) (layer F.SilkS) (width
0.2))
   (pad 200 smd rect (at -4 -31.5) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 198 smd rect (at -4 -30.9) (size 2 0.3) (layers F.Cu F.Paste
F.Mask))
   (pad 3 smd rect (at -4 -30.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 4 smd rect (at -4 -29.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 5 smd rect (at -4 -29.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 6 smd rect (at -4 -28.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 7 smd rect (at -4 -27.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 8 smd rect (at -4 -27.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 9 smd rect (at -4 -26.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -4 -26.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 11 smd rect (at -4 -25.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 12 smd rect (at -4 -24.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 13 smd rect (at -4 -24.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 14 smd rect (at -4 -23.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 15 smd rect (at -4 -23.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 16 smd rect (at -4 -22.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 17 smd rect (at -4 -21.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 18 smd rect (at -4 -21.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 19 smd rect (at -4 -20.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 20 smd rect (at -4 -20.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 21 smd rect (at -4 -19.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 22 smd rect (at -4 -18.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 23 smd rect (at -4 -18.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 24 smd rect (at -4 -17.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 25 smd rect (at -4 -17.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 26 smd rect (at -4 -16.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 27 smd rect (at -4 -15.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 28 smd rect (at -4 -15.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 29 smd rect (at -4 -14.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 30 smd rect (at -4 -14.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 31 smd rect (at -4 -13.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 32 smd rect (at -4 -12.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 33 smd rect (at -4 -12.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 34 smd rect (at -4 -11.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 35 smd rect (at -4 -11.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 36 smd rect (at -4 -10.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 37 smd rect (at -4 -9.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 38 smd rect (at -4 -9.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 39 smd rect (at -4 -8.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 40 smd rect (at -4 -8.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 41 smd rect (at -4 -7.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 42 smd rect (at -4 -6.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 43 smd rect (at -4 -6.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 44 smd rect (at -4 -5.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 45 smd rect (at -4 -5.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 46 smd rect (at -4 -4.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 47 smd rect (at -4 -3.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 48 smd rect (at -4 -3.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 49 smd rect (at -4 -2.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 50 smd rect (at -4 -2.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 51 smd rect (at -4 -1.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 52 smd rect (at -4 -0.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 53 smd rect (at -4 -0.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 54 smd rect (at -4 0.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 55 smd rect (at -4 0.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 56 smd rect (at -4 1.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 57 smd rect (at -4 2.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 58 smd rect (at -4 2.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 59 smd rect (at -4 3.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 60 smd rect (at -4 3.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 61 smd rect (at -4 4.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 62 smd rect (at -4 5.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 63 smd rect (at -4 5.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 64 smd rect (at -4 6.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 65 smd rect (at -4 6.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 66 smd rect (at -4 7.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 67 smd rect (at -4 8.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 68 smd rect (at -4 8.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 69 smd rect (at -4 9.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 70 smd rect (at -4 9.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 71 smd rect (at -4 10.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 72 smd rect (at -4 11.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 73 smd rect (at -4 11.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 74 smd rect (at -4 12.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 75 smd rect (at -4 12.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 76 smd rect (at -4 13.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 77 smd rect (at -4 14.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 78 smd rect (at -4 14.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 79 smd rect (at -4 15.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 42 smd rect (at -4 15.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 40 smd rect (at -4 20.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 88 smd rect (at -4 20.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 89 smd rect (at -4 21.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 90 smd rect (at -4 21.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 91 smd rect (at -4 22.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 92 smd rect (at -4 23.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 93 smd rect (at -4 23.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 94 smd rect (at -4 24.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 95 smd rect (at -4 24.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 96 smd rect (at -4 25.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 97 smd rect (at -4 26.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 98 smd rect (at -4 26.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 99 smd rect (at -4 27.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
(pad 100 smd rect (at -4 27.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 101 smd rect (at -4 28.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 102 smd rect (at -4 29.1) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 103 smd rect (at -4 29.7) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 6 smd rect (at -4 30.3) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 4 smd rect (at -4 30.9) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 2 smd rect (at -4 31.5) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
(pad 199 smd rect (at 4 -31.2) (size 2 0.3) (layers F.Cu F.Paste F.Mask)) (pad 197 smd rect (at 4 -30.6) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
   (pad 210 smd rect (at 4 -30) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
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   (pad 110 smd rect (at 4 30) (size 2 0.3) (layers F.Cu F.Paste F.Mask))
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)





Attachment: SODIMM200 292407_B1 Con better datasheet.pdf
Description: Adobe PDF document