kicad-developers team mailing list archive

[Wayne Stambaugh <stambaughw@xxxxxxxxx>]

On 3/23/2015 3:25 PM, Simon Richter wrote:
> Hi,
> 
> Am 23.03.2015 um 18:56 schrieb Chris Pavlina:
> 
>> KiCad does not currently support standalone vias, and I think that would
>> be a necessity before a *clean* implementation of this could be done.

This would have to be done first and it would require changes to the
file format, zone definition and filling, and the DRC at a minimum.
There are probably some other things I'm forgetting.  JP would have a
better idea of the effort involved.  Once this part is complete, then we
could start discussing tools for using standalone vias.  That being
said, I also think this is something useful to have but as Chris eluded
to it will not happen until after the next stable release.

> 
> I think these vias would be placed inside a copper pour, so there is
> something to "connect" them to. The notion of "generated" vias is new
> though (so if I change parameters for thermal relief, these vias can be
> deleted and recreated).
> 
> I'd like to tack a feature request on top of that: thermal via
> generation in pads. For my last project I simply used four rectangular
> pads with copper on top and bottom and a hole in the middle. This works,
> but for library submission I'd like to be able to express this in a
> cleaner way (i.e. one large pad, with an attribute how much thermal
> power it needs to sink).
> 
>    Simon
> 
> 
> 
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