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Re: How to handle mounting holes with satellite vias?

 

One method which comes to mind is to add yet another hole definition in
software, and that may be the best way to address the problem; this way we
can also ensure the correct thickness of the annulus and check the chosen
number/size of vias.

- Cirilo


On Mon, Jun 8, 2015 at 5:59 PM, Lorenzo Marcantonio <
l.marcantonio@xxxxxxxxxxxx> wrote:

> Having troubles getting an useable workflow with a common usage: the
> mounting
> hole with satellite vias (see attachment).
>
> Rationale: when you have a big hole for a screw and need to have plane
> connectivity, a PTH supported pad is often not a good choice. Mostly
> because on
> the wave solder machine they tend to get clogged (requiring an expensive
> peel
> mask). There are other reason, like ground plane impedance, but
> manufacturing
> convenience is the biggest one :P
>
> So I did the following thing:
>
> (module "HOLE-M4-NPTH" (layer "F.Cu") (tedit 557548BB)
>         (descr "Mechanical Hole, M4")
>         (attr virtual)
>         (fp_text reference "HOLE-M4-NPTH" (at 0 0) (layer "F.Fab")
>                  (effects (font (size 1.2 1.2) (thickness 0.12))))
>         (fp_text value "HOLE-M4-NPTH" (at 0 0) (layer "F.Fab") hide
>                  (effects (font (size 1.2 1.2) (thickness 0.12))))
>         (fp_circle (center 0 0) (end 5.85 0) (layer "F.CrtYd") (width
> 0.01))
>         (fp_circle (center 0 0) (end 5.85 0) (layer "B.CrtYd") (width
> 0.01))
>         (fp_circle (center 0 0) (end 5.5 0) (layer "F.SilkS") (width 0.12))
>         (fp_circle (center 0 0) (end 2.2 0) (layer "F.Fab") (width 0.12))
>         (fp_circle (center 0 0) (end 2.2 0) (layer "B.Fab") (width 0.12))
>         (fp_circle (center 0 0) (end 2.2 0) (layer "Dwgs.User") (width
> 0.12))
>         (pad "" np_thru_hole circle (at 0 0) (size 4.4 4.4) (drill 4.4)
> (layers "*.Cu"))
>         (pad "HOLE" smd circle (at 0 0) (size 8.35 8.35) (layers "*.Cu"))
>         (pad "HOLE" thru_hole circle (at 3.2 0) (size 0.8 0.8) (drill 0.4)
> (layers "*.Cu")
>              (zone_connect 2))
>         (pad "HOLE" thru_hole circle (at -3.2 0) (size 0.8 0.8) (drill
> 0.4) (layers "*.Cu")
>              (zone_connect 2))
>         (pad "HOLE" thru_hole circle (at 1.6 -2.8) (size 0.8 0.8) (drill
> 0.4) (layers "*.Cu")
>              (zone_connect 2))
>         (pad "HOLE" thru_hole circle (at -1.6 -2.8) (size 0.8 0.8) (drill
> 0.4) (layers "*.Cu")
>              (zone_connect 2))
>         (pad "HOLE" thru_hole circle (at -1.6 2.8) (size 0.8 0.8) (drill
> 0.4) (layers "*.Cu")
>              (zone_connect 2))
>         (pad "HOLE" thru_hole circle (at 1.6 2.8) (size 0.8 0.8) (drill
> 0.4) (layers "*.Cu")
>              (zone_connect 2)))
>
> I have a big SMD round pad on all layers for the support copper, an NPTH
> hole
> for the drill tape, and common pads for the satellite vias. The
> zone_connect forces solid fill, not that it would have really mattered
> (since there is the big pad covering all). Less cruft in the gerbers...
>
> Problem #1: pad snap always pick the big SMD pad and the track get
> rejected because it falls into the NPTH hole; workaround: disable pad
> snap and locate it by hands. Not a big issue since usually these are
> tied to fills and they attach correctly.
>
> Problem #2: the big pad and the NPTH hole are conflicting in the DRC
> (quite correctly, in theory). However that's a PITA because the message
> can 'obscure' more severe errors.
>
> Any idea on how to solve this?
>
> --
> Lorenzo Marcantonio
> Logos Srl
>
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