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Re: [RFC] Future, more flexible D_PAD class

 

In response to a message written on 09.09.2015, 21:26, from easyw:
It would also be nice to have a thermal via/pad class, without solder mask
and silk screen, visible/available also to python scripting... that would
improve footprint wizard to create QFN footprints with exposed pad and
thermal vias.
If someone analyzes, it is included in what I wrote „as many shapes as needed
(each shape <circle or rectangle or oval or sth else more new> has layer stack)”
and „as many drills as needed” in just one pad.

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Best Regards,
LordBlick


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