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Message #30378
Re: Additional Patch for via properties dialog (2)
Hi!
Maybe, some of these HDI Design Guides + documents are useful:
http://www.we-online.com/web/de/index.php/download/media/04_leiterplatte/2011_2/relaunch/produkte_5/microvia_hdi/141030_DesignGuide_HDI_1_1.pdf
Page 8 gives quite a good overview of what's possible - at least!
http://www.ilfa.de/wp-content/uploads/2016/09/ILFA-Designregeln-Multilayer.pdf
http://www.ilfa.de/wp-content/uploads/2016/09/ILFA-Designregeln-Starrflex.pdf
Some rules for Via-in-Pad or Via on top of Via on some layers, but not others might become a bit tricky.
Vias clearances can depend on the used drill diameter as well.
So there might not be a one clearance size fits all sizes in some designs.
Regards,
Clemens
On 2017-08-22 14:05, Bastian Neumannn wrote:
> Hi
>
>> Ultimately is it useful to design a board, if you cannot make it?
>
> Right now I can fabricate boards, I can not design. That is also not a good solution.
>
> via constraints are tricky bussiness as they are very specific to the manufacturer.
>
>> PS:
>> The current "tracks and vias editor" dialog is (for me) a not finished work:
>> It does not make any DRC test after editing, and this is *really annoying*.
>
> This is what I am working on at the moment. To have a propper mask where one can input constraints for vias.
>
> At the moment you can only define some layers. There is much more work to do. Like staggered/stacked µvias
>
> Inline-Bild 2
>
> Based on this dialog I plan on having more layer masks to only show layers described here.
>
> Cheers
>
> 2017-08-22 13:00 GMT+02:00 jp charras <jp.charras@xxxxxxxxxx <mailto:jp.charras@xxxxxxxxxx>>:
>
> Le 22/08/2017 à 12:10, Simon Küppers a écrit :
> > I second this. Working in a Research Institute I can assure you, that very often there are circuit
> > boards with "interesting" stackups and via configurations... These boards are not produced by
> > quick-turn factories like eurocircuits but companies such as ILFA or Optiprint.
> >
> > It would be unwise to cut out those users from KiCad.
>
> I dont't remember I said we should restrict vias to eurocircuits constraints.
>
> Moreover "very often there are circuit boards with "interesting" stackups and via configurations"
> lead me to think there are constraints, unless I missed something.
> (if there are "via configurations", there are constraints)
>
> I don't think eurocircuits is at quick-turn factory (although I have myself any experience about
> blind/buried vias) but I think blind/buried vias can have constraints, because I saw constraints in
> board houses.
>
> Ultimately is it useful to design a board, if you cannot make it?
>
> In fact, Pcbnew is really lacking a board stackup editor, to define not only the stackup layers, but
> some other parameters (via parameters, copper thickness, dielectric thickness and type, and a few
> other parameters).
>
> This board stackup definition is needed not only for vias, but also for impedance controlled boards.
>
> PS:
> The current "tracks and vias editor" dialog is (for me) a not finished work:
> It does not make any DRC test after editing, and this is *really annoying*.
>
>
> >
> >
> > Am 2017-08-22 09:57, schrieb hauptmech:
> >> On 22/08/17 18:25, jp charras wrote:
> >>> Le 22/08/2017 à 05:55, hauptmech a écrit :
> >>>> Manufacturing techniques vary between manufacturers and continuously evolve. Why would kicad limit
> >>>> itself to what eurocircuits can do? They have optimized their process for quick turn prototyping
> >>>> and
> >>>> while they document their process nicely, they are probably not a good reference for what can be
> >>>> done.
> >>>>
> >>>> On 21/08/17 05:44, jp charras wrote:
> >>>>> Before working on blind and buried vias dialog, please have a look at:
> >>>>> https://www.eurocircuits.com/blog/Blind-and-buried-vias <https://www.eurocircuits.com/blog/Blind-and-buried-vias>
> >>> Currently there is no control in Kicad.
> >>>
> >>> Sure, but it looks like there are some constraints on blind/buried vias (microvias are blind/buried
> >>> vias) depending on board houses.
> >>>
> >>> So it could be worth to be able to control these constraints inside Kicad (at least to have a
> >>> minimal control).
> >>>
> >>> We currently have a DRC which detects too small clearances and track widths:
> >>> this is most of time due to manufacturing constraints which continuously evolve.
> >>>
> >> I don't think I have enough understanding of the proposal to have an
> >> opinion. I just want to caution against creating unnecessary
> >> limitations in kicad. It really depends on the board house. I used to
> >> work for one and there were quite a few atypical techniques used for
> >> customer specific projects (many kept confidential to that customer).
> >>
> >>
> >>
> >>
> >>
> >> _______________________________________________
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> >> Post to : kicad-developers@xxxxxxxxxxxxxxxxxxx <mailto:kicad-developers@xxxxxxxxxxxxxxxxxxx>
> >> Unsubscribe : https://launchpad.net/~kicad-developers <https://launchpad.net/~kicad-developers>
> >> More help : https://help.launchpad.net/ListHelp <https://help.launchpad.net/ListHelp>
> >
> > _______________________________________________
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> > Post to : kicad-developers@xxxxxxxxxxxxxxxxxxx <mailto:kicad-developers@xxxxxxxxxxxxxxxxxxx>
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> > More help : https://help.launchpad.net/ListHelp <https://help.launchpad.net/ListHelp>
>
>
> --
> Jean-Pierre CHARRAS
>
> _______________________________________________
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>
>
>
>
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References
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Additional Patch for via properties dialog (2)
From: Bastian Neumannn, 2017-08-18
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-19
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-19
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-20
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Re: Additional Patch for via properties dialog (2)
From: hauptmech, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: hauptmech, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: Simon Küppers, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: Bastian Neumannn, 2017-08-22