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Message #30385
Re: Additional Patch for via properties dialog (2)
On 8/22/2017 8:05 AM, Bastian Neumannn wrote:
> Hi
>
>> Ultimately is it useful to design a board, if you cannot make it?
>
> Right now I can fabricate boards, I can not design. That is also not a
> good solution.
>
> via constraints are tricky bussiness as they are very specific to the
> manufacturer.
I'm not opposed to this change. However, there are two schools of
thought when it comes to board layout: strict layout constraints and no
layout constraints. I tend to lean towards the latter but I've been
doing this for 30 years so I am painfully aware of the pitfalls of no
layout constraints and have a pretty good idea of what not to do.
Should we choose to loosen the layout constraints for blind/buried vias,
then we should be prepared for a serious tongue lashing the first time
someone violates their board vendor's manufacturing limitations and ends
up with a bunch of useless and likely expensive boards. Maybe at some
point in the future we will have a complete constraint system that can
cover all possibilities but until then we have to walk that fine line
between power users and beginners.
>
>> PS:
>> The current "tracks and vias editor" dialog is (for me) a not finished work:
>> It does not make any DRC test after editing, and this is *really annoying*.
>
> This is what I am working on at the moment. To have a propper mask where
> one can input constraints for vias.
>
> At the moment you can only define some layers. There is much more work
> to do. Like staggered/stacked µvias
>
> Inline-Bild 2
>
> Based on this dialog I plan on having more layer masks to only show
> layers described here.
>
> Cheers
>
> 2017-08-22 13:00 GMT+02:00 jp charras <jp.charras@xxxxxxxxxx
> <mailto:jp.charras@xxxxxxxxxx>>:
>
> Le 22/08/2017 à 12:10, Simon Küppers a écrit :
> > I second this. Working in a Research Institute I can assure you, that very often there are circuit
> > boards with "interesting" stackups and via configurations... These boards are not produced by
> > quick-turn factories like eurocircuits but companies such as ILFA or Optiprint.
> >
> > It would be unwise to cut out those users from KiCad.
>
> I dont't remember I said we should restrict vias to eurocircuits
> constraints.
>
> Moreover "very often there are circuit boards with "interesting"
> stackups and via configurations"
> lead me to think there are constraints, unless I missed something.
> (if there are "via configurations", there are constraints)
>
> I don't think eurocircuits is at quick-turn factory (although I have
> myself any experience about
> blind/buried vias) but I think blind/buried vias can have
> constraints, because I saw constraints in
> board houses.
>
> Ultimately is it useful to design a board, if you cannot make it?
>
> In fact, Pcbnew is really lacking a board stackup editor, to define
> not only the stackup layers, but
> some other parameters (via parameters, copper thickness, dielectric
> thickness and type, and a few
> other parameters).
>
> This board stackup definition is needed not only for vias, but also
> for impedance controlled boards.
>
> PS:
> The current "tracks and vias editor" dialog is (for me) a not
> finished work:
> It does not make any DRC test after editing, and this is *really
> annoying*.
>
>
> >
> >
> > Am 2017-08-22 09:57, schrieb hauptmech:
> >> On 22/08/17 18:25, jp charras wrote:
> >>> Le 22/08/2017 à 05:55, hauptmech a écrit :
> >>>> Manufacturing techniques vary between manufacturers and
> continuously evolve. Why would kicad limit
> >>>> itself to what eurocircuits can do? They have optimized their
> process for quick turn prototyping
> >>>> and
> >>>> while they document their process nicely, they are probably not
> a good reference for what can be
> >>>> done.
> >>>>
> >>>> On 21/08/17 05:44, jp charras wrote:
> >>>>> Before working on blind and buried vias dialog, please have a
> look at:
> >>>>> https://www.eurocircuits.com/blog/Blind-and-buried-vias
> <https://www.eurocircuits.com/blog/Blind-and-buried-vias>
> >>> Currently there is no control in Kicad.
> >>>
> >>> Sure, but it looks like there are some constraints on
> blind/buried vias (microvias are blind/buried
> >>> vias) depending on board houses.
> >>>
> >>> So it could be worth to be able to control these constraints
> inside Kicad (at least to have a
> >>> minimal control).
> >>>
> >>> We currently have a DRC which detects too small clearances and
> track widths:
> >>> this is most of time due to manufacturing constraints which
> continuously evolve.
> >>>
> >> I don't think I have enough understanding of the proposal to have an
> >> opinion. I just want to caution against creating unnecessary
> >> limitations in kicad. It really depends on the board house. I used to
> >> work for one and there were quite a few atypical techniques used for
> >> customer specific projects (many kept confidential to that customer).
> >>
> >>
> >>
> >>
> >>
> >> _______________________________________________
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> >
> > _______________________________________________
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> > Post to : kicad-developers@xxxxxxxxxxxxxxxxxxx
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>
>
> --
> Jean-Pierre CHARRAS
>
> _______________________________________________
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> Post to : kicad-developers@xxxxxxxxxxxxxxxxxxx
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>
>
>
>
> _______________________________________________
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>
Follow ups
References
-
Additional Patch for via properties dialog (2)
From: Bastian Neumannn, 2017-08-18
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-19
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-19
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-20
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Re: Additional Patch for via properties dialog (2)
From: hauptmech, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: hauptmech, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: Simon Küppers, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: jp charras, 2017-08-22
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Re: Additional Patch for via properties dialog (2)
From: Bastian Neumannn, 2017-08-22