kicad-developers team mailing list archive

[Greg Smith <ecomputerd@xxxxxxxxx>]

 Here are some references to a variety of stackup information:
 # interesting info on cores, prepreg, and foils # https://www.multi-circuit-boards.eu/en/pcb-design-aid/layer-buildup/prepreg-core-foil.html # More terminology: # http://www.edn.com/design/pc-board/4424239/PCB-design-basics # PCB manufacturing info from advanced circuits (4pcb): # http://www.4pcb.com/media/building-printed-circuit-board.pdf



    On Friday, September 1, 2017, 5:12:35 AM CDT, Ingo Kletti <ikletti@xxxxxxxxxxxxxxxx> wrote:  
 
 

Am 01.09.2017 um 10:06 schrieb jp charras:
 > Could you give a link to a manufactured that explains applications 
(and show a few boards) where
 > different substrates are used.
 From experience I can say that many (non-ceramic) RF materials are 
rather soft (most common a mix of PTFE and glass fiber reinforcement) 
and thin.

In the designs that I worked on , we therefore created 4-layer PCBs with 
a core consisting of more rigid material (most times FR4).

Another mix of materials might be PCBs with a solid metal backing used 
for cooling applications (think LED lighting, motor drivers, etc.).

And another application for mixed materials are flex-rigid PCBs.

While the different PCBs types are not explained in detail, the brochure 
from Optiprint has some photos of complex designs:

http://www.optiprint.ch/pdf/Optiprint_Imagebroschuere_2014_EN.pdf


_______________________________________________
Mailing list: https://launchpad.net/~kicad-developers
Post to    : kicad-developers@xxxxxxxxxxxxxxxxxxx
Unsubscribe : https://launchpad.net/~kicad-developers
More help  : https://help.launchpad.net/ListHelp