kicad-developers team mailing list archive

[Simon Küppers <simon.kueppers@xxxxxx>]

Yes, a common stackup would be a two-layer rf substrate such as Teflon pressed onto a two-layer fr4 core with an fr4 prepreg in between. Galvanic processing is then done as usual. 
Best regards 
Simon 

Am 11. September 2017 19:07:19 MESZ schrieb jp charras <jp.charras@xxxxxxxxxx>:
>Le 01/09/2017 à 12:38, Simon Küppers a écrit :
>> I was also about to show the optiprint brochure, thanks. I fully
>agree with you. We especially like
>> to use Teflon materials with thick copper backing, but fr4 plus
>ceramic is also quite common here.
>> 
>> 
>
>Hi Simon,
>
>Do you mean the *same board* has (for instance for a 8 layers board)
>the 2 external dielectrics made
>in Teflon and the 5 internal dielectrics use fr4 and prepegs?
>I am seeing the interest, but this is unclear for me when reading
>brochures.
>
>(The Gerber job file format is currently being finalized, and can be
>slightly modified)
>
>
>-- 
>Jean-Pierre CHARRAS
>
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