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Re: New feature: support for Gerber job file.


Yes this could be the case, and also for rigid-flex boards.  I see from the
spec that you already disclaim that the initial version of the job file
will not work for these types of boards (Section 2, last few paragraphs)

In the area I work, rigid-flex circuits are quite common (and I'm sure for
all the people working in RF, heterogenous stackups are also quite
common).  I think if possible it would be good to at least put some sketch
of how this would be included in the job file spec.  Competing formats like
ODB++ already support this quite well, so it seems like a good idea for
Ucamco to include.


On Mon, Sep 11, 2017 at 1:07 PM, jp charras <jp.charras@xxxxxxxxxx> wrote:

> Le 01/09/2017 à 12:38, Simon Küppers a écrit :
> > I was also about to show the optiprint brochure, thanks. I fully agree
> with you. We especially like
> > to use Teflon materials with thick copper backing, but fr4 plus ceramic
> is also quite common here.
> >
> >
> Hi Simon,
> Do you mean the *same board* has (for instance for a 8 layers board) the 2
> external dielectrics made
> in Teflon and the 5 internal dielectrics use fr4 and prepegs?
> I am seeing the interest, but this is unclear for me when reading
> brochures.
> (The Gerber job file format is currently being finalized, and can be
> slightly modified)
> --
> Jean-Pierre CHARRAS
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