kicad-developers team mailing list archive

[Seth Hillbrand <seth@xxxxxxxxxxxxx>]

Hi Wayne-

I don't think that the relief chamfering is controlled by that option.  
We also don't chamfer the connection on the way into the pad, so I'd 
tend to agree with Jeff that the extra corner chamfer on only one side 
of the connection might be unnecessary.

It looks like the original knockout code was JP's so I'd be curious to 
hear why they were originally added.

-Seth


On 2019-06-21 08:05, Wayne Stambaugh wrote:
> Jeff,
>
> Users are going to expect chamfering if there is an option for it.  I
> don't see how you are going to avoid adding chamfering to the spokes
> unless we decide to do away with chamfering as an option.  I don't 
> think
> that's good idea because right angles on board geometry is generally
> frowned upon.
>
> Wayne
>
> On 6/20/19 4:24 PM, Jeff Young wrote:
> > Turns out there’s a slightly unintended side effect.
> >
> > Before:
> >
> > Note the two truncated thermal spokes to the surface-mount pads at the
> > lower right.
> >
> > After:
> >
> >
> >
> >
> > The bug is fixed, but not that the junctions between the spokes and 
> > the
> > zone body are no longer chamfered.
> >
> > I’d say the “after” is better in that respect too, but again it’s
> > definitely different.
> >
> > Thoughts?
> >
> > Cheers,
> > Jeff.
> >
> >
> > > On 20 Jun 2019, at 19:50, Reece Pollack <reece@xxxxxxx
> > > <mailto:reece@xxxxxxx>> wrote:
> > >
> > > Memory is the second thing to go as one ages.
> > >
> > > I can't remember what the first one is.
> > >
> > > ------------------------------------------------------------------------
> > > *From: *"Jeff Young" <jeff@xxxxxxxxx <mailto:jeff@xxxxxxxxx>>
> > > *To: *"jp charras" <jp.charras@xxxxxxxxxx 
> > > <mailto:jp.charras@xxxxxxxxxx>>
> > > *Cc: *"KiCad Developers" <kicad-developers@xxxxxxxxxxxxxxxxxxx
> > > <mailto:kicad-developers@xxxxxxxxxxxxxxxxxxx>>
> > > *Sent: *Thursday, June 20, 2019 2:46:58 PM
> > > *Subject: *Re: [Kicad-developers] 6.0 Zone filling differences
> > >
> > > Wow.  That’s sobering.  I wrote the board outline clearance changes….
> > >
> > > Age sucks.
> > >
> > >
> > >     On 20 Jun 2019, at 19:04, jp charras <jp.charras@xxxxxxxxxx
> > >     <mailto:jp.charras@xxxxxxxxxx>> wrote:
> > >
> > >     Le 20/06/2019 à 19:24, Jeff Young a écrit :
> > >
> > >         I believe we now have a warning, but I can’t remember what
> > >         change it was for.  I thought it was for the outline changes,
> > >         but from what I can find on the mailing list archive it looks
> > >         like we were satisfied that one wouldn’t change anything.
> > >
> > >         So remind me what the warning is for?
> > >
> > >
> > >     AFAIK, it is for board outline clearance change (taking in 
> > > accounf or
> > >     not the edge cut graphic items thickness, if I correctly 
> > > remember).
> > >     Zone outline changes (only activated if the kicad_advanced
> > >     "ForceThickZones=0" option enables it), do not need any warning.
> > >
> > >
> > >         The reason behind this request is that I have a new fill
> > >         algorithm which fixes a long-standing bug regarding one pad’s
> > >         thermal ring knocking out another pad’s thermal spoke.  It
> > >         also allows thermal spokes on custom pad shapes (and would
> > >         allow us to support custom number of spokes if we wished).
> > >
> > >         While this should only change zone fills which would have 
> > > been
> > >         considered errors in the past, it nevertheless changes them.
> > >          What’s the prescription for that?
> > >
> > >         Cheers,
> > >         Jeff.
> > >
> > >
> > >
> > >
> > >     -- 
> > >     Jean-Pierre CHARRAS
> > >
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