kicad-developers team mailing list archive

[Nick Østergaard <oe.nick@xxxxxxxxx>]

Mmm, I am not sure I under stamd that screenshot. Why are the zone not
touchimg the thermal track between the pads while it looks like there is a
part of zone area on the middle of the thermal track?

lør. 22. jun. 2019 17.58 skrev Jeff Young <jeff@xxxxxxxxx>:

> Our current algorithm will produce thermal connections between two pads
> (with no connections to the zone):
>
>
> I assume no one will lose any sleep over dropping those?
>
> Cheers,
> Jeff.
>
>
> On 21 Jun 2019, at 19:49, Jean-Paul Louis <louijp@xxxxxxxxx> wrote:
>
> Wayne,
>
> Except in very hugh frequency design (higher UHF spectrum, microwaves and
> millimeter waves)
> were chamfers can create more problems than they solve.
>
> This chamfer should be user optional, the best being individual part
> layout optional.
>
> Just my extra data point,
>
> Jean-Paul
> N1JPL
>
>
> On Jun 21, 2019, at 8:05 AM, Wayne Stambaugh <stambaughw@xxxxxxxxx> wrote:
>
> Jeff,
>
> Users are going to expect chamfering if there is an option for it.  I
> don't see how you are going to avoid adding chamfering to the spokes
> unless we decide to do away with chamfering as an option.  I don't think
> that's good idea because right angles on board geometry is generally
> frowned upon.
>
> Wayne
>
> On 6/20/19 4:24 PM, Jeff Young wrote:
>
> Turns out there’s a slightly unintended side effect.
>
> Before:
>
> Note the two truncated thermal spokes to the surface-mount pads at the
> lower right.
>
> After:
>
>
>
>
> The bug is fixed, but not that the junctions between the spokes and the
> zone body are no longer chamfered.
>
> I’d say the “after” is better in that respect too, but again it’s
> definitely different.
>
> Thoughts?
>
> Cheers,
> Jeff.
>
>
> On 20 Jun 2019, at 19:50, Reece Pollack <reece@xxxxxxx
> <mailto:reece@xxxxxxx <reece@xxxxxxx>>> wrote:
>
> Memory is the second thing to go as one ages.
>
> I can't remember what the first one is.
>
> ------------------------------------------------------------------------
> *From: *"Jeff Young" <jeff@xxxxxxxxx <mailto:jeff@xxxxxxxxx
> <jeff@xxxxxxxxx>>>
> *To: *"jp charras" <jp.charras@xxxxxxxxxx <mailto:jp.charras@xxxxxxxxxx
> <jp.charras@xxxxxxxxxx>>>
> *Cc: *"KiCad Developers" <kicad-developers@xxxxxxxxxxxxxxxxxxx
> <mailto:kicad-developers@xxxxxxxxxxxxxxxxxxx
> <kicad-developers@xxxxxxxxxxxxxxxxxxx>>>
> *Sent: *Thursday, June 20, 2019 2:46:58 PM
> *Subject: *Re: [Kicad-developers] 6.0 Zone filling differences
>
> Wow.  That’s sobering.  I wrote the board outline clearance changes….
>
> Age sucks.
>
>
>   On 20 Jun 2019, at 19:04, jp charras <jp.charras@xxxxxxxxxx
>   <mailto:jp.charras@xxxxxxxxxx <jp.charras@xxxxxxxxxx>>> wrote:
>
>   Le 20/06/2019 à 19:24, Jeff Young a écrit :
>
>       I believe we now have a warning, but I can’t remember what
>       change it was for.  I thought it was for the outline changes,
>       but from what I can find on the mailing list archive it looks
>       like we were satisfied that one wouldn’t change anything.
>
>       So remind me what the warning is for?
>
>
>   AFAIK, it is for board outline clearance change (taking in accounf or
>   not the edge cut graphic items thickness, if I correctly remember).
>   Zone outline changes (only activated if the kicad_advanced
>   "ForceThickZones=0" option enables it), do not need any warning.
>
>
>       The reason behind this request is that I have a new fill
>       algorithm which fixes a long-standing bug regarding one pad’s
>       thermal ring knocking out another pad’s thermal spoke.  It
>       also allows thermal spokes on custom pad shapes (and would
>       allow us to support custom number of spokes if we wished).
>
>       While this should only change zone fills which would have been
>       considered errors in the past, it nevertheless changes them.
>        What’s the prescription for that?
>
>       Cheers,
>       Jeff.
>
>
>
>
>   --
>   Jean-Pierre CHARRAS
>
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