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solder paste



1. when i created the gerber files i noticed that the size of the solder paste is bigger then the pad itself, this can cause to mutch tin on the pad, is ther a possability to change the size of the solder paste ?

2. when i am trying to put extra vias (for example adding gnd vias ) after a while (i think after reloading the design again) kicad disconnect the viafrom the plan and release the plane around the via 
please assist  

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