kicad-developers team mailing list archive

[Dick Hollenbeck <dick@xxxxxxxxxxx>]

On 02/09/2012 01:51 PM, Brian F. G. Bidulock wrote:
> Dick,
>
> On Thu, 09 Feb 2012, Dick Hollenbeck wrote:
>> Clever, and with different orientation of the pad pair, I suppose you can accurately
>> control the spacing between the pair as you go.  ?
> Yup.  And copying this GAP module retains the netnames on the pads so that
> one can position them ahead of where you want to lay the pair.  I put one
> at the edge of the breakout region of a BGA so that I can get wild from
> there.
>
> --brian

I did something vaguely similar under a BGA with VIAs. 

In the footprint editor, when developing a BGA footprint, I placed through hole pads also,
on grid, each nearby a ball pad by the same name.  Then with the proper solder mask
setting, and pad name same as the nearby SMT ball pad, I was able to convert those through
holes effectively into pre-placed vias.

Then during routing you had some help in tying into the something that would help with the
fan out.

Some day it would be nice if the "module editor" could actually edit modules, rather than
mere footprints.  Where module equals the pads and the fan out traces.