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Re: Simplified vias patch proposal


On Tue, Jun 26, 2012 at 12:32:33AM +0200, Samuel Lesueur wrote:

> Anyway, I am currently designing an open source 300W DC motor controller 
> and I need a huge amount of vias to handle the current flow from the top layer 
> where my MOSFET transistors are installed to the bottom and its huge GND zone. 

At last a fellow power designer :D I vote yes for bottom side cooling...

The idea is very interesting since I had the same problem (I solved putting the vias as pad in the fet package... as an extra it gives you untented vias which have better thermal performance).

I've only a doubt... do these via 'survive' the track cleanup?

Lorenzo Marcantonio
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