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On 3/27/2013 5:38 PM, Karl Schmidt wrote:
It could take two layers to do this - One layer to mask-out the default paste and a second layer to put in what you want. But I don't think many are using it at all so just reversing the function might be a simple useful fix. Right now the solder-paste layer adds area's to put solder paste on - not exactly useful. What is most often needed is a way to reduce the solder-paste under parts that want to 'float-away'.
Have you tried entering a negative number in either the solder paste clearance or solder paste ratio settings? This should reduce the solder mask as a fixed distance or a percentage of the total area of a pad depending on which setting you use. You can do this globally for every pad by setting these values in the Pads Mask Clearance properties dialog, on a per module basis using the Module Properties dialog, or on a pad by pad basis using the "Local Clearance and Settings" tab in the Pad Properties dialog.
(In my old notes - this layer WAS called solder-paste-mask - which suggests it was to 'mask' solder-paste - probably what it should do.) To understand why this is needed - look at pg-12 of http://www.nxp.com/documents/data_sheet/PBSS8110X.pdf The right way is to use less paste under some areas. I can't think of a need to add paste - just a need to mask it out - so it could be done with one layer - but the layer that is used in the stable release is applied as an addition, not a mask. If the solder-paste layer could be subtracted from the solder-paste gerber that is generated from the pads, it would solve this problem easily.
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