kicad-developers team mailing list archive

[Dick Hollenbeck <dick@xxxxxxxxxxx>]

On 12/01/2010 02:29 AM, jean-pierre charras wrote:
> Le 01/12/2010 04:47, Dick Hollenbeck a écrit :
>   
>> Thanks Jean-Pierre.
>>
>> I changed to polygon fills everywhere with min zone size of 0.006
>>
>> Attached are two png images which show the problem with and without pads
>> on top.  The problem actually might not be with the boost library but
>> with the algorithm used to specify the voids for pads.
>>
>> Compare the two images, and you'll see that simply by turning on pads
>> the problems with the zone reside in the region of some low pitch pads.
>>
>> Dick
>>     
> I found the bug: algo that removes unconnected thermal stubs when using thermal pads was always running in boost version, and 
> removed some sub areas in filled zone areas.
> boost::polygon is not the culprit, and seems now work fine.
> But obviously needs now more tests.
>   

Thanks Jean-Pierre.  The boost::polygon build seems to now creat a good
copper area in the region which was previously giving us grief.  Nice
job catching that.

Perhaps we have enough confidence now to switch over to boost::polygon
as the default choice in the CMakeLists.txt file?

This way we can begin to get more boards to exercise that code.

At some point we should also probably update the stable branch also.

Thanks,

Dick