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Re: Simplified vias patch proposal
On Wed, Jun 27, 2012 at 11:13:25AM +0200, Samuel Lesueur wrote:
> Imagine if we can add a feature that draw those termal vias during the
> "zone filling" process. It would be so usefull for power designers !
I actually have modules with an array of tht pads :D
This also solves another via problem: currently vias can only be all
tented or all untented (it's a plot option). Thermal vias should be
untented (for obvious reason), impedence vias do not.
So the via-module is a trick to have untented via with an otherwise
tented design. As a bonus you can add these pads to another layer
(adhesive, for example) to specify filled vias, if you need that kind of
Before adding the floating via I would enrich first the via data
structure, otherwise it's not very useful...