kicad-lib-committers team mailing list archive

[Kerusey Karyu <keruseykaryu@xxxxx>]

Sorry. This should be sent to the list.


W dniu 23.02.2014 13:33, Vesa Solonen pisze:
> My proposal is making a set of strict rules to follow, just like coding
> style guide. Otherwise stuff is not accepted in the "official" distribution.
>
> -Vesa
I analyzed the situation a bit and I wanna suggest some general rules:

1. Always use upper case where applicable.
2. When manufacturer uses some mix with upper and lower case, and this
is non-standard package use manufacturer code.
3. Always try to replace manufacturer "very crappy" package code with
the standard one, unless this is wide accepted code.
4. If package have some variants like more pins than standard one or
different pitch, etc. always provide this in the footprint name.


So. An example list of footprint names adequate to these rules (IMHO).

SOT23, SC70 - strict rule no. 1
SOT23-5, TO252-5 - rule no. 1 and rule no. 4 because of five pin's variants
DPACK - rule no. 1, equivalent of standard TO252; rule no. 3 omitted
because this is well know housing name
SO8 - rule no. 1 but this is the code for 150mil body version *)
SOIC8 - rule no. 1 but this code applied to the 200mil body version
(Wide SO8). *)
SOP8 - partial rule no. 4 this is SO8 variant with a bottom pad
TQFP64-0.5p - rule no. 1 and rule np. 4; it means: TQFP package, 64pins,
0.5mm pitch.
QFN64-9x9-0.5p - rule no. 1 and rule no.4; it means QFN package, 64pads,
body size 9x9mm, 0.5mm pitch
DFN16-3x4-0.45p - like above; rectangular dual in line package
eSIP-7C - rule no. 2
DBVR - rule no. 3, this is the TI's freaky code for something very close
to SOT23-5

*) Generally this is a little weird due to existing JEDEC and EIAJ
standards for Small Outline cases. I recognize those footprints using
these names, but maybe I'm wrong.

Kerusey Karyu