kicad-lib-committers team mailing list archive

[Carl Poirier <carl.poirier.2@xxxxxxxxx>]

I just noticed I had sent this to you only instead of the list:

I believe for now the only convention-like we have is this:
> https://lists.launchpad.net/kicad-developers/msg11729.html
>
> We should first elaborate a bit more on that convention, and then we could
> write it down on the wiki.
>

Regarding your last email, do you have any reason why not to put a dash
between "SOT" and "23", for example? If we have to change all of these, it
will be another disruptive change for the users.

Carl


On Tue, Feb 25, 2014 at 12:31 PM, Kerusey Karyu <keruseykaryu@xxxxx> wrote:

>
> Sorry. This should be sent to the list.
>
>
>
> W dniu 23.02.2014 13:33, Vesa Solonen pisze:
>
>>
>> My proposal is making a set of strict rules to follow, just like coding
>> style guide. Otherwise stuff is not accepted in the "official"
>> distribution.
>>
>> -Vesa
>>
>>  I analyzed the situation a bit and I wanna suggest some general rules:
>
> 1. Always use upper case where applicable.
> 2. When manufacturer uses some mix with upper and lower case, and this
> is non-standard package use manufacturer code.
> 3. Always try to replace manufacturer "very crappy" package code with
> the standard one, unless this is wide accepted code.
> 4. If package have some variants like more pins than standard one or
> different pitch, etc. always provide this in the footprint name.
>
>
> So. An example list of footprint names adequate to these rules (IMHO).
>
> SOT23, SC70 - strict rule no. 1
> SOT23-5, TO252-5 - rule no. 1 and rule no. 4 because of five pin's variants
> DPACK - rule no. 1, equivalent of standard TO252; rule no. 3 omitted
> because this is well know housing name
> SO8 - rule no. 1 but this is the code for 150mil body version *)
> SOIC8 - rule no. 1 but this code applied to the 200mil body version
> (Wide SO8). *)
> SOP8 - partial rule no. 4 this is SO8 variant with a bottom pad
> TQFP64-0.5p - rule no. 1 and rule np. 4; it means: TQFP package, 64pins,
> 0.5mm pitch.
> QFN64-9x9-0.5p - rule no. 1 and rule no.4; it means QFN package, 64pads,
> body size 9x9mm, 0.5mm pitch
> DFN16-3x4-0.45p - like above; rectangular dual in line package
> eSIP-7C - rule no. 2
> DBVR - rule no. 3, this is the TI's freaky code for something very close
> to SOT23-5
>
> *) Generally this is a little weird due to existing JEDEC and EIAJ
> standards for Small Outline cases. I recognize those footprints using
> these names, but maybe I'm wrong.
>
>
> Kerusey Karyu
>
>
>
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