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Re: Polygon work
Vesa Solonen <vsolonen@...>
Sat, 24 Jan 2009 00:29:02 +0200 (EET)
Alpine 1.99 (SOC 1136 2008-08-12)
On Fri, 23 Jan 2009, jean-pierre.charras@... wrote:
I am thinking (but i can be wrong) the main advantage of thermal reliefs
is to allow unsoldering defective components.
Mainly on multilayers (4 and more layers), without thermal reliefs,
unsoldering thought pins is very difficult
Second that. Also if you have to make boards without soldermask (by hand
or oven) thermal reliefs will help in confining the flow. Without thermals
maskless fine pitch smd will be really annoying, so I think there have to
be per pad keepout and thermal defines or at least some pad/pin class type
definitions. It makes no sense to make the whole board with tight
tolerances if there is just one tqfp sitting in the middle of the power
electronics (where one would need some clearance anyway). Maybe that could
be solved by allowing zones in zones with different parameters? Zones in
zones would be really nice for confining different 'local grounds' too.
Naturally separale keepout layer will do.
Any thoughts where the February release goals would be? Are we going to
get along next Ubuntu cycle? Is there definitely going to be release in