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Re: Simplified vias patch proposal


On Thu, Jun 28, 2012 at 02:50:51PM +0200, Miguel Angel Ajo Pelayo wrote:
> *this can cause trouble at manufacturing if not well handled but it's a
> good way to reduce parasitic impedance*.

You need to make sure that solder paste stays on the pad and don't go
down the via. It's also used with BGAs in a (somewhat expensive) process
called 'pads on via'

IIRC there is nothing in the drc which block 'colliding' components (we
don't either have courtyard information to do that) so it should work
without problem.

Lorenzo Marcantonio
Logos Srl

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