kicad-developers team mailing list archive

[Jean-Paul Louis <louijp@xxxxxxxxx>]

Hi Carl,

I agree with you, we need to publish a Rev 1.0 of the rules and start from there.
Your rule set looks good to me, and I’ll help to answer questions as they arise. 
Believe me, they will <):D

my $0.02,
Jean-Paul
AC9GH


On May 1, 2014, at 2:47 PM, Carl Poirier <carl.poirier.2@xxxxxxxxx> wrote:

> > I was hoping for some convention like this to array soon since I'm making new components for every project and I would love them to follow the KiCad convention so they can be contributed. Carl, could you please upload a document with those conventions that are already decided? Like naming, perhaps. 
> 
> I do think we are better to make official what we have now, and then continue from there. I have corrected the few points discussed previously with Lorenzo, so the following should be good to go. Are there any other concerns? I would like to commit this in the root of kicad-library directly, in the form of a text file.
> 
> 
> General Rules:
> 
> 1. Writing uses C-style naming with the first letter of each word being capitalized. Ex: "Socket_Strip_Straight_2x06"
> 2. Every acronym has all of its letters capitalized.
> 3. Manufacturer name is capitalized as usual. Ex: NEC, Microchip
> 4. Component name must match its filename
> 5. When dimensions are used in part name, they are in millimeters and unit is not capitalized. Ex: "Cap_10x13mm_RM5"
> 6. Filename is the same as the part name
> 
> 
> Symbols:
> 
> 1. Using a 100mil grid, pin ends and origin must lie on grid nodes (IEC-60617)
> 2. Pin must have a length of 100mil or more in increments of 50mil if number needs more space
> 3. Black-box components group pins logically, for example by function set, and ports in counter-clockwise position.
> 4. Whenever possible, inputs are on the left and outputs are on the right.
> 
> 
> Footprint Library Names: 
> 
> 1. Part type (resistor, cap, etc), must be in plural form
> 2. Package type (SOIC, SMD, etc)
> 3. Manufacturer
> 4. Part number
> 
> 
> Footprints:
> 
> 1. Follows datasheet recommendation unless intentional variation, for example longer pads for hand soldering
> 2. Pad 1 must be on the left first, then at the top, except at the top for PLCC. (IPC-7351)
> 3. For through-hole components, origin is set on pad 1.
> 4. For surface-mount devices, origin is placed in the middle with respect to device lead ends. (IPC-7351)
> 
> 
> Names for footprints of Surface-Mount Devices (SMD):
> 
> 1. Specific package feature first, not separated by anything.
> 2. Package name, numbers separated from letters using hyphen Ex: "SOT-89"
> 3. Pin number is expanded with '+' sign for extra pads to package, with acronym for type of pad. Ex: Exposed pad under QFP: "QFP-48+1EP"
> 4. Variation of package, separated by another hyphen. Ex: "SOT-23-5"
> 5. If it's a manufacturer-specific package, name can be appended, separated by an underscore.
> 6. Any modification to the original footprint, indicated by appending the reason. Ex: longer pads are used to facilitate hand soldering of a QFN component: "QFN-52_HandSoldering"
> 
> 
> Names for footprints of common devices, such as resistors, capacitors, etc:
> 
> 1. Name of part, may be shortened for common components. ex: "Cap", "Socket_Strip", etc.
> 2. Dimension, which may include at its end the positioning. Ex: "TO-220_Horiz", "1x02_Angled"
> 3. Pad distance, in the form of an RM rating.
> 4. Any modification to the original footprint, indicated by appending the reason.
> 
> 
> Names for footprints of specific devices:
> 
> 1. Name of part.
> 2. Part number. Ex: "Oscillator_SI570"
> 4. Any modification to the original footprint, indicated by appending the reason.
> 
> 
> On Tue, Apr 29, 2014 at 4:22 AM, Lorenzo Marcantonio <l.marcantonio@xxxxxxxxxxxx> wrote:
> On Tue, Apr 29, 2014 at 10:14:41AM +0200, Mariusz Radzimirski wrote:
> > As most of symbols have pins created using grid 100 (2x50), it is reasonable
> > to use grid 100 when drawing wires on schematic.
> 
> It's a one-liner. Actually TWO lines. One in sch_screen.cpp and one
> wherever the ID_POPUP values are defined. However care should be taken,
> read the comment at the begin of the definition.
> 
> > BTW, I think there should be possibility to use user defined grid size in
> > Eeschema instead of predefined few grid sizes. It would solve the problem.
> 
> Seems overkill to me, especially in the view of the future LU stuff.
> 
> --
> Lorenzo Marcantonio
> Logos Srl
> 
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> 
> 
> On Tue, Apr 29, 2014 at 4:22 AM, Lorenzo Marcantonio <l.marcantonio@xxxxxxxxxxxx> wrote:
> On Tue, Apr 29, 2014 at 10:14:41AM +0200, Mariusz Radzimirski wrote:
> > As most of symbols have pins created using grid 100 (2x50), it is reasonable
> > to use grid 100 when drawing wires on schematic.
> 
> It's a one-liner. Actually TWO lines. One in sch_screen.cpp and one
> wherever the ID_POPUP values are defined. However care should be taken,
> read the comment at the begin of the definition.
> 
> > BTW, I think there should be possibility to use user defined grid size in
> > Eeschema instead of predefined few grid sizes. It would solve the problem.
> 
> Seems overkill to me, especially in the view of the future LU stuff.
> 
> --
> Lorenzo Marcantonio
> Logos Srl
> 
> _______________________________________________
> Mailing list: https://launchpad.net/~kicad-developers
> Post to     : kicad-developers@xxxxxxxxxxxxxxxxxxx
> Unsubscribe : https://launchpad.net/~kicad-developers
> More help   : https://help.launchpad.net/ListHelp
> 
> _______________________________________________
> Mailing list: https://launchpad.net/~kicad-developers
> Post to     : kicad-developers@xxxxxxxxxxxxxxxxxxx
> Unsubscribe : https://launchpad.net/~kicad-developers
> More help   : https://help.launchpad.net/ListHelp