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Message #00230
Re: Adhesive for SMD components
On Mon, Sep 15, 2014 at 06:38:27PM -0400, Carl Poirier wrote:
> What I mean is I want it to be as simple as possible for potential
> contributors. I don't want to require them to read the IPC-7351 documents.
You have to pay for them anyway :P
> So from what I understand, C says:
>
> Everything at 0.15, except BGA which is 0.25 for <0.3mm, 0.5 for <0.5mm,
> and then progressive from 0.5mm to 1mm.
No. In 'C' leadless at 0.15; leaded at 0.25; and BGA/capacitors at 0.5 (the
progression is done by some tool only);
Otherwise stick at the 'B' where substantially you can do everything at
0.25, can components at 0.5 and BGA at 1.0; also round everything on
a grid of 0.05 (that was done for imperial parts too; 'C' has both
metric and imperial).
I think that users needing the 'C' integration level will draw their own
library after talking with the manufacturer.
--
Lorenzo Marcantonio
Logos Srl
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