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Re: Adhesive for SMD components

 

On Tue, Sep 16, 2014 at 1:12 AM, Lorenzo Marcantonio <
l.marcantonio@xxxxxxxxxxxx> wrote:

> On Mon, Sep 15, 2014 at 06:38:27PM -0400, Carl Poirier wrote:
> > What I mean is I want it to be as simple as possible for potential
> > contributors. I don't want to require them to read the IPC-7351
> documents.
>
> You have to pay for them anyway :P
>

That's why I don't have access to it myself haha.


>
> > So from what I understand, C says:
> >
> > Everything at 0.15, except BGA which is 0.25 for <0.3mm, 0.5 for <0.5mm,
> > and then progressive from 0.5mm to 1mm.
>
> No. In 'C' leadless at 0.15; leaded at 0.25; and BGA/capacitors at 0.5 (the
> progression is done by some tool only);
>
> Otherwise stick at the 'B' where substantially you can do everything at
> 0.25, can components at 0.5 and BGA at 1.0; also round everything on
> a grid of 0.05 (that was done for imperial parts too; 'C' has both
> metric and imperial).
>
> I think that users needing the 'C' integration level will draw their own
> library after talking with the manufacturer.
>

Ok, I'm fine with that. Let's go with 7351-B.

Thanks for the information.


>
> --
> Lorenzo Marcantonio
> Logos Srl
>
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