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Re: Adhesive for SMD components

 

Just a quick question, is there any problem with the courtyard exceeding
the PCB edges? In this case, is the DRC supposed to fail? I'm thinking
about board edge connectors.

On Tue, Sep 16, 2014 at 8:49 AM, Carl Poirier <carl.poirier.2@xxxxxxxxx>
wrote:

>
>
> On Tue, Sep 16, 2014 at 1:12 AM, Lorenzo Marcantonio <
> l.marcantonio@xxxxxxxxxxxx> wrote:
>
>> On Mon, Sep 15, 2014 at 06:38:27PM -0400, Carl Poirier wrote:
>> > What I mean is I want it to be as simple as possible for potential
>> > contributors. I don't want to require them to read the IPC-7351
>> documents.
>>
>> You have to pay for them anyway :P
>>
>
> That's why I don't have access to it myself haha.
>
>
>>
>> > So from what I understand, C says:
>> >
>> > Everything at 0.15, except BGA which is 0.25 for <0.3mm, 0.5 for <0.5mm,
>> > and then progressive from 0.5mm to 1mm.
>>
>> No. In 'C' leadless at 0.15; leaded at 0.25; and BGA/capacitors at 0.5
>> (the
>> progression is done by some tool only);
>>
>> Otherwise stick at the 'B' where substantially you can do everything at
>> 0.25, can components at 0.5 and BGA at 1.0; also round everything on
>> a grid of 0.05 (that was done for imperial parts too; 'C' has both
>> metric and imperial).
>>
>> I think that users needing the 'C' integration level will draw their own
>> library after talking with the manufacturer.
>>
>
> Ok, I'm fine with that. Let's go with 7351-B.
>
> Thanks for the information.
>
>
>>
>> --
>> Lorenzo Marcantonio
>> Logos Srl
>>
>> --
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>
>

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