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Message #00243
Re: Adhesive for SMD components
On Mon, Oct 13, 2014 at 11:14:48AM -0400, Carl Poirier wrote:
> Just a quick question, is there any problem with the courtyard exceeding
> the PCB edges? In this case, is the DRC supposed to fail? I'm thinking
> about board edge connectors.
Uhm good question.
I don't remember anything about the board in the standard. AFAIK the
courtyard is meant as a 'intercomponent' space, so it shouldn't matter.
I do RAST card edges in this way if it helps:
(module "CARDEDGE-RAST25-3" placed (layer "F.Cu") (tedit 514EEA2A)
(descr "Direct Mating RAST 2.5 edge - 3 pin")
(attr virtual)
(fp_text reference "CARDEDGE-RAST25-3" (at 0 0) (layer "F.SilkS") (effects (font (size 1.2 1.2) (thickness 0.12)))
)
(fp_text value "CARDEDGE-RAST25-3" (at 0 0) (layer "F.SilkS") hide (effects (font (size 1.2 1.2) (thickness 0.12)))
)
(fp_line (start 5.75 -8.55) (end 5.75 0) (layer "F.CrtYd") (width 0.01))
(fp_line (start 5.75 0) (end 5 0) (layer "F.CrtYd") (width 0.01))
(fp_line (start 5 0) (end 5 -2) (layer "F.CrtYd") (width 0.01))
(fp_line (start 5 -2) (end -5 -2) (layer "F.CrtYd") (width 0.01))
(fp_line (start -5 -2) (end -5 -8.55) (layer "F.CrtYd") (width 0.01))
(fp_line (start -5 -8.55) (end 5.75 -8.55) (layer "F.CrtYd") (width 0.01))
(fp_line (start 4.4 -4.8) (end 5.6 -4.2) (layer "F.SilkS") (width 0.12))
(fp_line (start 5.6 -4.2) (end 5.6 -5.4) (layer "F.SilkS") (width 0.12))
(fp_line (start 5.6 -5.4) (end 4.4 -4.8) (layer "F.SilkS") (width 0.12))
(fp_line (start -5 -2) (end -5 0) (layer "Edge.Cuts") (width 0.12))
(fp_line (start 5 -2) (end 5 0) (layer "Edge.Cuts") (width 0.12))
(fp_line (start 5 -2) (end -5 -2) (layer "Edge.Cuts") (width 0.12))
(pad "3" connect rect (at -2.5 -4.8) (size 1.7 4.6) (layers "*.Cu" "*.Mask"))
(pad "2" connect rect (at 0 -4.8) (size 1.7 4.6) (layers "*.Cu" "*.Mask"))
(pad "1" connect rect (at 2.5 -4.8) (size 1.7 4.6) (layers "*.Cu" "*.Mask"))
(pad "1" thru_hole oval (at 2.5 -7.5) (size 1.7 2) (drill 0.8 (offset 0 0.2)) (layers "*.Cu" "*.Mask"))
(pad "2" thru_hole oval (at 0 -7.5) (size 1.7 2) (drill 0.8 (offset 0 0.2)) (layers "*.Cu" "*.Mask"))
(pad "3" thru_hole oval (at -2.5 -7.5) (size 1.7 2) (drill 0.8 (offset 0 0.2)) (layers "*.Cu" "*.Mask"))
(pad "" connect rect (at 0 -4.8) (size 8 5.1) (layers "*.Mask"))
)
--
Lorenzo Marcantonio
Logos Srl
Follow ups
References
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Re: Adhesive for SMD components
From: Lorenzo Marcantonio, 2014-09-15
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Re: Adhesive for SMD components
From: jp charras, 2014-09-15
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Re: Adhesive for SMD components
From: Carl Poirier, 2014-09-15
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Re: Adhesive for SMD components
From: Lorenzo Marcantonio, 2014-09-15
-
Re: Adhesive for SMD components
From: Carl Poirier, 2014-09-15
-
Re: Adhesive for SMD components
From: Lorenzo Marcantonio, 2014-09-15
-
Re: Adhesive for SMD components
From: Carl Poirier, 2014-09-15
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Re: Adhesive for SMD components
From: Lorenzo Marcantonio, 2014-09-16
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Re: Adhesive for SMD components
From: Carl Poirier, 2014-09-16
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Re: Adhesive for SMD components
From: Carl Poirier, 2014-10-13